Display panel motherboards, display panels, and methods for manufacturing display panel

Abstract

A display panel motherboard is provided. The display panel motherboard includes a plurality of display panels and a cutting reserved area, and at least a portion of the cutting reserved area is provided with a first reflective layer. The first reflective layer and a source/drain of the display panel are positioned on a same layer.

1 . A display panel motherboard comprising:
 a plurality of display panels; and   a cutting reserved area surrounding each of the display panels;   wherein at least a portion of the cutting reserved area is provided with a first reflective layer, and the first reflective layer and a source/drain of the display panel are positioned on a same layer.   
     
     
         2 . The display panel motherboard according to  claim 1 , wherein the cutting reserved area is at least located on one side of the display panel, and the first reflective layer is disposed in the cutting reserved area. 
     
     
         3 . The display panel motherboard according to  claim 1 , wherein the display panel comprises a binding area, the binding area being located on one side of the display panel; and the cutting reserved area provided with the first reflective layer and the binding area is located on different sides of the display panel. 
     
     
         4 . The display panel motherboard according to  claim 3 , wherein a side surface of the display panel without the binding area and the cutting reserved area are provided with the first reflective layer. 
     
     
         5 . The display panel motherboard according to  claim 1 , wherein the first reflective layer comprises a metal reflective layer or a metal alloy reflective layer. 
     
     
         6 . The display panel motherboard according to  claim 1 , wherein the first reflective layer has a multi-layer structure, and the first reflective layer is a Ti/Al/Ti laminates or a Mo/Al/Mo laminates. 
     
     
         7 . The display panel motherboard according to  claim 1 , wherein the display panel further comprises an encapsulation area, the cutting reserved area surrounds the encapsulation area, and a non-display area in the encapsulation area is provided with a second reflective layer. 
     
     
         8 . The display panel motherboard according to  claim 7 , wherein the first reflective layer and the second reflective layer are disposed on a same layer. 
     
     
         9 . The display panel motherboard according to  claim 8 , wherein the first reflective layer and the second reflective layer are both metal reflective layers. 
     
     
         10 . The display panel motherboard according to  claim 1 , wherein the display panel comprises a thin film encapsulation structure, the thin film encapsulation structure is disposed on the display area and the encapsulation area, and the thin film encapsulation structure has a groove defined at an interval. 
     
     
         11 . The display panel motherboard according to  claim 10 , wherein the display area is provided with a pixel defining layer, and the encapsulation area is provided with a first dam and a second dam, the first dam and the second dam surround the pixel defining layer, the thin film encapsulation structure comprises at least two inorganic encapsulation layers disposed in a stacked manner, and an organic encapsulation layer disposed between two adjacent inorganic encapsulation layers, the inorganic encapsulation layer in the thin film encapsulation structure is disposed on an interval between the first dam and the second dam. 
     
     
         12 . A display panel, formed by cutting a display panel motherboard according to  claim 1 , the display panel comprising:
 a display area; and   an encapsulation area, the encapsulation area surrounding an outer circumference of the display area, and having a second reflective layer disposed in the encapsulation area.   
     
     
         13 . The display panel according to  claim 12 , further comprising:
 a substrate; and   a cover plate disposed opposite to the substrate;   wherein the encapsulation area is formed by an encapsulation layer, the encapsulation layer bonds the substrate and the cover plate;   the substrate, the encapsulation layer, and the cover plate enclose a sealed space disposing a display device, and the encapsulation layer is provided with a groove, the groove opening faces or faces away from the cover plate, and the groove is filled with heat absorbing material.   
     
     
         14 . The display panel according to  claim 13 , wherein the groove is opened on a surface of the encapsulation layer along an enclosing direction of the encapsulation layer. 
     
     
         15 . The display panel according to  claim 13 , wherein the encapsulation layer is annular, and the groove is disposed adjacent to an outer edge of the encapsulation layer. 
     
     
         16 . The display panel according to  claim 13 , wherein a thickness of the groove is less than a thickness of the encapsulation layer. 
     
     
         17 . The display panel according to  claim 13 , wherein a width of the groove is one-third to one-half of a width of the encapsulation layer. 
     
     
         18 . The display panel according to  claim 13 , wherein a cross section of the groove along a direction perpendicular to the cover plate is a curved surface. 
     
     
         19 . A method of manufacturing a display panel, comprising:
 providing a substrate;   defining a display area and an encapsulation area on the substrate;   coating a heat absorbing material at an edge of the encapsulation area;   coating glass beads on the heat absorbing material, the glass beads covering the entire heat absorbing material;   disposing a display device on the display area of the substrate, and bonding the substrate and a cover plate to form a sealed space; and   cutting along a coating area of the heat absorbing material by using a laser.   
     
     
         20 . The method for manufacturing a display panel according to  claim 19 , wherein the heat absorbing material liquefies or vaporizes during being laser-cut and after being laser-cut.