Substrate-free interconnected electronic mechanical structural systems

Abstract

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

1 . A substrate-free, interconnected electronic mechanical structural system, comprising:
 a first substrate-free, electronic subsystem comprising a plurality of sequential planar layers of a material disposed parallel to a first plane; and   a second substrate-free, electronic subsystem comprising:
 a plurality of sequential planar layers of a material disposed parallel to a second selected plane, the layers including at least one waveguide having an outer conductor and a center conductor disposed therein and a syntactic foam disposed between the outer and center conductors, the waveguide formed from and including the plurality of sequential planar layers, 
 wherein the first and second electronic subsystems are operably electrically and mechanically connected to one another. 
   
     
     
         2 . (canceled) 
     
     
         3 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein the first subsystem comprises at least one waveguide coupling termination structured to electronically and mechanically connect to the at least one waveguide of the second substrate-free, electronic subsystem. 
     
     
         4 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein of at least one of the first and second subsystems comprises one or more of a filter, coupler, and a combiner. 
     
     
         5 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein at least one of the first and second subsystems comprises one or more of a heterogeneous component and a monolithic component. 
     
     
         6 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein at least one of the subsystems comprises an electromechanical component. 
     
     
         7 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein at least one of the subsystems comprises a beam forming network. 
     
     
         8 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein the first and second substrate-free, electronic subsystems are disposed in one or more of electrical, thermal, optical, and/or fluidic communication. 
     
     
         9 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein at least one of the subsystems comprises mechanically interconnected DC and RF transmission lines. 
     
     
         10 . (canceled) 
     
     
         11 . (canceled) 
     
     
         12 . (canceled) 
     
     
         13 . (canceled) 
     
     
         14 . (canceled) 
     
     
         15 . (canceled) 
     
     
         16 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein the first and second subsystems are generally planar structures disposed orthogonal to one another. 
     
     
         17 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein the first and second subsystems are configured to slide relative to one another. 
     
     
         18 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , wherein the first and second subsystems are configured to pivot relative to one another. 
     
     
         19 . The substrate-free, interconnected electronic mechanical structural system according to  claim 1 , comprising a base subsystem configured to connect and join the first and second subsystems to one another. 
     
     
         20 . (canceled)