Thermal interface

Abstract

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.

1 . A thermal interface comprising:
 a thermally conductive cap including:
 a base defining a plurality of cap openings; 
 a finger extending from the base; and 
 an extension extending from the base; and 
   a gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings.   
     
     
         2 . The thermal interface of  claim 1 , further comprising a pad including a pliant thermal interface material. 
     
     
         3 . The thermal interface of  claim 1 , further comprising an adhesive located between the gasket and the base of the cap. 
     
     
         4 . The thermal interface of  claim 1 , wherein the gasket openings are smaller than the cap openings. 
     
     
         5 . The thermal interface of  claim 1 , wherein the finger is a first finger and the cap includes a plurality of fingers, including the first finger. 
     
     
         6 . The thermal interface of  claim 1 , wherein the extension has a length greater than a length of the finger. 
     
     
         7 . The thermal interface of  claim 1 , wherein the cap is configured to be positioned at an end face of a header of an optical subassembly, and the finger and the extension are configured to be positioned at a side of the header. 
     
     
         8 . The thermal interface of  claim 1 , wherein the cap includes copper. 
     
     
         9 . An optoelectronic module comprising:
 a shell including a seat;   an optical subassembly including a header having a plurality of leads;   a thermal interface comprising:
 a thermally conductive cap including:
 a base defining a plurality of cap openings; 
 a finger extending from the base; and 
 an extension extending from the base; and 
 
 a gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings, 
   wherein the cap is positioned on the header of the optical subassembly such that the leads are located within the cap openings and the gasket openings, and the extension of the cap is positioned within the seat of the shell.   
     
     
         10 . The optoelectronic module of  claim 9 , wherein the thermal interface further includes a pad located between the seat of the shell and the extension of the cap, the pad including a pliant thermal interface material. 
     
     
         11 . The optoelectronic module of  claim 9 , wherein the thermal interface further includes an adhesive located between the gasket and the base of the cap. 
     
     
         12 . The optoelectronic module of  claim 9 , wherein the gasket openings are smaller than the cap openings. 
     
     
         13 . The optoelectronic module of  claim 9 , wherein the finger is a first finger and the cap includes a plurality of fingers, including the first finger. 
     
     
         14 . The optoelectronic module of  claim 9 , wherein the extension has a length greater than a length of the finger. 
     
     
         15 . The optoelectronic module of  claim 9 , wherein the cap includes copper. 
     
     
         16 . The optoelectronic module of  claim 9 , wherein the optical subassembly includes a transmitter optical subassembly. 
     
     
         17 . The optoelectronic module of  claim 16 , wherein the transmitter optical subassembly includes a thermoelectric cooler.