Fan system and sound suppression method thereof

Abstract

A fan system is used for dissipating heat of an electronic device. The fan system includes a fan, a hollow structure, and a control circuit. Sound waves made by the fan are transmitted to an interior of the hollow structure when the fan is operating. The control circuit is connected to the hollow structure and is configured to control deformation/deformations of the hollow structure according to a state/states of the fan and/or the electronic device, which change a volume of the interior of the hollow structure for making a resonance frequency of the hollow structure being approximate to a rotation speed of the fan or being the same as the rotation speed of the fan.

What is claimed is: 
     
         1 . A fan system for cooling an electronic device, comprising:
 a fan;   a hollow structure in the shape of a neck container, with a sound wave transmitted to the hollow structure when the fan is operating; and   at least one control circuit connected to the hollow structure and configured to control a deformation degree of the hollow structure based on an operation state of at least one of the fan and the electronic device.   
     
     
         2 . The fan system according to  claim 1 , wherein the hollow structure comprises a body and a neck, the body has a first width in a first direction and the neck has a second width in the first direction, the second width is smaller than the first width, and the body is connected to the neck to surround and form an interior of the hollow structure. 
     
     
         3 . The fan system according to  claim 1  further comprising a channel, with the hollow structure comprising an interior, the channel extended to the fan and communicated with the interior of the hollow structure, and the sound wave transmitted to the hollow structure through the channel. 
     
     
         4 . The fan system according to  claim 1 , wherein the material of the hollow structure is shape memory alloy, and the at least one control circuit heats the hollow structure to change the thickness of the hollow structure. 
     
     
         5 . The fan system according to  claim 2 , wherein the material of the body and the neck is shape memory alloy, and the at least one control circuit heats at least one of the body and the neck to change the respective thickness of at least one of the body and the neck. 
     
     
         6 . The fan system according to  claim 2 , wherein the body comprises a plurality of shape memory alloy planes connected to each other, and the at least one control circuit heats the shape memory alloy planes to change the thickness of the body. 
     
     
         7 . The fan system according to  claim 2 , wherein the neck comprises a plurality of shape memory alloy planes connected to each other, and the at least one control circuit heats the shape memory alloy planes to change the thickness of the neck. 
     
     
         8 . A fan system for cooling an electronic device, and the fan system comprising:
 a fan;   a body surrounding the fan, wherein an interior face of the body faces the fan and is spaced from the fan, the interior face comprises a groove, and the fan transmits a sound wave to the groove; and   a control circuit connected to the body, wherein the control circuit controls the deformation of the body based on an operation state of at least one of the fan and the electronic device for changing the volume of the groove.   
     
     
         9 . The fan system according to  claim 8 , wherein the material of the body is shape memory alloy, and the control circuit heats the body to change the thickness of the body. 
     
     
         10 . The fan system according to  claim 8 , wherein the groove comprises a first width in a first direction. 
     
     
         11 . The fan system according to  claim 8 , wherein the groove comprises a first section and a second section in a first direction, and the interior face is closer to the first section than to the second section, the first section comprises a second width in a second direction and the second section comprises a third width in the second direction, and the second width is smaller than the third width. 
     
     
         12 . A fan system for cooling an electronic device, and the fan system comprising:
 a fan;   a body surrounding the fan, wherein the body comprises an interior face and a side face next to the interior face, wherein the interior face faces the fan and the interior face is spaced from the fan, the side face comprises a groove, and a sound wave is transmitted to the groove when the fan is operating; and   a control circuit connected to the body, wherein the control circuit controls the deformation of the body based on the operation state of at least one of the fan and the electronic device for changing the volume of the groove.   
     
     
         13 . The fan system according to  claim 12 , wherein the material of the body is a shape memory alloy, and the control circuit heats the body to change the thickness of the body. 
     
     
         14 . The fan system according to  claim 12 , wherein the groove comprises a first section and a second section in a first direction, the side face is closer to the first section than to the second section, and the first section has a first width in a second direction and the second section has a second width in the second direction, and the first width is smaller than the second width.