Method of manufacturing a printed circuit board

Abstract

Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

1 . A printed circuit board or a sub-assembly thereof comprising the following elements:
 at least two elements of insulating material being coupled or connected on at least one side surface,   
       wherein one of the at least two elements is arranged in a cut out area of the other one of the at least two elements,
 at least one layer of structured conductive material directly on both adjacent surfaces of the adjacent two elements of insulating material, 
 at least one further layer of the printed circuit board being provided at least partly directly on the elements of insulating material, 
 
       wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties, 
       wherein the at least one further layer of the printed circuit board provided at directly on the elements of insulating material is at least partly overlapping both, the one element of insulating material arranged in the cut out area and the one element of insulating material comprising the cut out area, 
       wherein the at least one layer of structured conductive material is arranged between the at least one further layer of the printed circuit board and the two elements of insulating material, such that the at least one layer of structured conductive is directly in contact with the at least one further layer of the printed circuit board and with both adjacent surfaces of the adjacent elements of insulating material; 
       wherein a layer of structured conductive material is provided on at least one surface of the elements of insulating material. 
     
     
         2 . The printed circuit board or a sub-assembly thereof according to  claim 1 , wherein the elements of insulating material are provided with protrusions and corresponding recesses on adjacent side surfaces for mutual coupling or connection. 
     
     
         3 . The printed circuit board or a sub-assembly thereof according to  claim 1 , wherein at least one of the elements of insulating material to be connected or coupled is made of flexible material to be coupled or connected with an element made of rigid insulating material. 
     
     
         4 . The printed circuit board or a sub-assembly thereof according to  claim 1 , wherein when using flexible elements of insulating material, a further layer of the printed circuit board is provided, with an opening at least partially according to a flexible element of the insulating material and/or is aligned with the flexible elements of insulating material. 
     
     
         5 . The printed circuit board or a sub-assembly thereof according to  claim 1 , wherein the layer of conductive material is placed in direct contact with the elements of insulating material. 
     
     
         6 . The printed circuit board or a sub-assembly thereof according to  claim 1 , wherein the layer of structured conductive material is removed from parts of the element of insulating material in the cut out area such that the parts of the element of insulating material are exposed to air. 
     
     
         7 . A printed circuit board or a sub-assembly thereof comprising the following elements:
 at least two elements of insulating material being coupled or connected on at least one side surface,   
       wherein one of the at least two elements is arranged in a cut out area of the other one of the at least two elements,
 at least one layer of structured conductive material directly on both adjacent surfaces of the adjacent two elements of insulating material, 
 at least one further layer of the printed circuit board being provided at least partly directly on the elements of insulating material, 
 
       wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties, 
       wherein the at least one further layer of the printed circuit board provided at directly on the elements of insulating material is at least partly overlapping both, the one element of insulating material arranged in the cut out area and the one element of insulating material comprising the cut out area, 
       wherein the at least one layer of structured conductive material is arranged between the at least one further layer of the printed circuit board and the two elements of insulating material, such that the at least one layer of structured conductive is directly in contact with the at least one further layer of the printed circuit board and with both adjacent surfaces of the adjacent elements of insulating material; 
       wherein the elements of insulating material are provided with protrusions and corresponding recesses on adjacent side surfaces for mutual coupling or connection. 
     
     
         8 . A printed circuit board or a sub-assembly thereof comprising the following elements:
 at least two elements of insulating material being coupled or connected on at least one side surface,   
       wherein one of the at least two elements is arranged in a cut out area of the other one of the at least two elements,
 at least one layer of structured conductive material directly on both adjacent surfaces of the adjacent two elements of insulating material, 
 at least one further layer of the printed circuit board being provided at least partly directly on the elements of insulating material, 
 
       wherein the elements of insulating material are made of insulating material having different mechanical, chemical or physical properties, 
       wherein the at least one further layer of the printed circuit board provided at directly on the elements of insulating material is at least partly overlapping both, the one element of insulating material arranged in the cut out area and the one element of insulating material comprising the cut out area, 
       wherein the at least one layer of structured conductive material is arranged between the at least one further layer of the printed circuit board and the two elements of insulating material, such that the at least one layer of structured conductive is directly in contact with the at least one further layer of the printed circuit board and with both adjacent surfaces of the adjacent elements of insulating material; 
       wherein when using flexible elements of insulating material a further layer of the printed circuit board is provided, with an opening at least partially according to a flexible element of the insulating material and/or is aligned with the flexible elements of insulating material.