Multilayer circuit board manufacturing method

Abstract

A method for manufacturing a multilayer circuit board containing a single-sided metal-clad laminate sheet and a substrate laminated together, the single-sided metal-clad laminate sheet containing a thermoplastic liquid crystal polymer film and a metal foil bonded to a surface of the thermoplastic liquid crystal polymer film, and the method containing: forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and heat treating the laminate sheet, wherein the heat treatment satisfies conditions (1) and (2) to manufacture the single-sided metal-clad laminate sheet: (1) a heat treatment temperature ranges between 1° C. inclusive and 50° C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film, and (2) a time for the heat treatment ranges from one second to 10 minutes.

1 - 6 . (canceled) 
     
     
         7 : A method for manufacturing a multilayer circuit board comprising a single-sided metal-clad laminate sheet and a substrate laminated together, the single-sided metal-clad laminate sheet comprising a thermoplastic liquid crystal polymer film and a metal foil bonded to a surface of the thermoplastic liquid crystal polymer film, and the method comprising:
 forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and heat treating the laminate sheet, wherein the heat treatment satisfies conditions (1) and (2) to manufacture the single-sided metal-clad laminate sheet:   (1) a heat treatment temperature ranges between 1° C. inclusive and 50° C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film, and   (2) a time for the heat treatment ranges from one second to 10 minutes.   
     
     
         8 : The method of  claim 7 , wherein the metal foil has a low roughness. 
     
     
         9 : The method of  claim 7 , wherein the multilayer circuit board further comprises another single-sided metal-clad laminate sheet, a substrate having a circuit pattern, or a film substrate.