Pcb, package structure, terminal, and pcb processing method

Abstract

The PCB includes a component soldering region disposed on the PCB, where the component soldering region includes a first region and a second region; first pads are disposed in the first region, and the first pads are configured to connect to a component through soldering; and the second region is a blank region, first grooves are disposed in the second region, and the second region is configured to connect to the component by using glue. In this application, the first grooves are added in the second region, so that a surface of the second region is of a three-dimensional structure. This increases a contact area between the second region and the glue, enhancing a bonding force between the PCB and the component, and avoiding relative displacement between the second region and the component.

1 . A printed circuit board PCB, comprising a component soldering region disposed on the PCB, wherein the component soldering region comprises a first region and a second region; first pads are disposed in the first region, and the first pads are configured to connect to a component through soldering; and the second region is a blank region, first grooves are disposed in the second region, and the second region is configured to connect to the component by using glue;
 wherein the second region is coated with an ink layer, second pads are further disposed in the second region, the first groove is located between the second pad and the ink layer, and the second pad is insulated from a circuit in or the component on the PCB.   
     
     
         2 . (canceled) 
     
     
         3 . The PCB according to  claim 1 , wherein second grooves are further disposed in the second region, wherein a width of the second groove and a width of the first groove are the same or different, and a depth of the second groove and a depth of the first groove are the same or different. 
     
     
         4 . The PCB according to  claim 3 , wherein the first groove communicates with the second groove. 
     
     
         5 . The PCB according to  claim 3 , wherein the depth of the first groove and/or that of the second groove are/is not greater than a thickness of the ink layer. 
     
     
         6 . (canceled) 
     
     
         7 . (canceled) 
     
     
         8 . A printed circuit board PCB processing method, comprising:
 processing first pads in a first region of a component soldering region of a PCB, wherein the first pads are connected to a circuit in the PCB, and the first pads are configured to connect to a component through soldering, wherein the component soldering region comprises the first region and a second region, and the second region is a blank region;   coating an ink layer on the blank region; and   processing first grooves in the blank region;   wherein before the coating an ink layer on the blank region, the method further comprises:   processing second pads in the blank region, wherein the second pad is located between the first groove and the ink layer, and the second pad is insulated from the circuit in or the component on the PCB.   
     
     
         9 . (canceled) 
     
     
         10 . The PCB processing method according to  claim 8 , wherein the method further comprises:
 processing second grooves in the blank region, wherein a width of the second groove and a width of the first groove are the same or different, and a depth of the second groove and a depth of the first groove are the same or different.   
     
     
         11 . The PCB according to  claim 4 , wherein the depth of the first groove and/or that of the second groove are/is not greater than a thickness of the ink layer. 
     
     
         12 . A terminal, the terminal comprises the printed circuit board PCB, wherein the PCB, comprising a component soldering region disposed on the PCB, wherein the component soldering region comprises a first region and a second region; first pads are disposed in the first region, and the first pads are configured to connect to a component through soldering; and the second region is a blank region, first grooves are disposed in the second region, and the second region is configured to connect to the component by using glue;
 wherein the second region is coated with an ink layer, second pads are further disposed in the second region, the first groove is located between the second pad and the ink layer, and the second pad is insulated from a circuit in or the component on the PCB.   
     
     
         13 . The terminal according to  claim 12 , wherein second grooves are further disposed in the second region, wherein a width of the second groove and a width of the first groove are the same or different, and a depth of the second groove and a depth of the first groove are the same or different. 
     
     
         14 . The terminal according to  claim 13 , wherein the first groove communicates with the second groove. 
     
     
         15 . The terminal according to  claim 13 , wherein the depth of the first groove and/or that of the second groove are/is not greater than a thickness of the ink layer. 
     
     
         16 . The terminal according to  claim 14 , wherein the depth of the first groove and/or that of the second groove are/is not greater than a thickness of the ink layer.