US2020061704A1PendingUtilityA1
Method for manufacturing photo-sintering particle, method for manufacturing photo-sintering target, and photo-sintering method
Est. expiryApr 20, 2037(~10.8 yrs left)· nominal 20-yr term from priority
B22F 2999/00B22F 3/10B22F 7/04B41M 7/0081B22F 1/0014B22F 1/0018B22F 3/105B22F 1/16B22F 1/054B22F 1/145B22F 1/052B22F 3/1003C23C 16/48C23C 20/06C23C 14/223C23C 8/10B22F 2301/255B22F 2301/10C23C 16/40
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Abstract
Provided is a method for manufacturing photonic sintering particles. According to an embodiment, the method includes: preparing nano particles; and forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method for manufacturing photonic sintering particles, the method comprising:
preparing nano particles; and forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles.
2 . The method of claim 1 , wherein in the forming of the oxide films, oxide films of a first thickness are formed on the surfaces of the nano particles when the thermal conductivity of the substrate is lower than a predetermined reference value, and oxide films of a second thickness are formed on the surfaces of the nano particles when the thermal conductivity of the substrate is higher than the predetermined reference value, and
wherein the first thickness is smaller than the second thickness.
3 . The method of claim 2 , wherein the predetermined reference value is 1 W/mK.
4 . The method of claim 2 , wherein the first thickness is 1% to 3% of the diameters of the nano particles, and the second thickness is 3% to 10% of the diameters of the nano particles.
5 . A method for manufacturing a photonic sintering target, the method comprising:
preparing nano particles; forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles; and manufacturing a conductive target by providing a binder resin in the nano particles, on which the oxide films are formed.
6 . The method of claim 5 , wherein in the forming of the oxide films, oxide films of a first thickness are formed on the surfaces of the nano particles when the thermal conductivity of the substrate is lower than a predetermined reference value, and oxide films of a second thickness are formed on the surfaces of the nano particles when the thermal conductivity of the substrate is higher than the predetermined reference value, and
wherein the first thickness is smaller than the second thickness.
7 . The method of claim 6 , wherein the predetermined reference value is 1 W/mK.
8 . The method of claim 6 , wherein the first thickness is 1% to 3% of the diameters of the nano particles, and the second thickness is 3% to 10% of the diameters of the nano particles.
9 . A photonic sintering method, comprising:
forming oxide films having different thicknesses with reference to the thermal conductivity of a substrate, on which the nano particles are to be formed, on surfaces of the nano particles; manufacturing a conductive target by providing a binder resin in the nano particles, on which the oxide films are formed; forming the manufactured conductive target on the substrate; and photonic-sintering the conductive target formed on the substrate.
10 . The method of claim 9 , wherein in the forming of the oxide films, oxide films of a first thickness are formed on the surfaces of the nano particles when the thermal conductivity of the substrate is lower than a predetermined reference value, and oxide films of a second thickness are formed on the surfaces of the nano particles when the thermal conductivity of the substrate is higher than the predetermined reference value, and the first thickness is smaller than the second thickness, and
wherein in the photonic-sintering of the conductive target, light of a first intensity is irradiated to the substrate when the thermal conductivity of the substrate is lower than the predetermined reference value and light of a second intensity is irradiated to the substrate when the thermal conductivity of the substrate is higher than the predetermined reference value, and the first intensity is lower than the second intensity.
11 . A method for manufacturing photonic sintering particles, the method comprising:
determining whether it is necessary to form oxide films on the surfaces of the nano particles according to the characteristics of the substrate, on which the nano particles are to be formed; and when it is necessary to form the oxide films on the surfaces of the nano particles, forming oxide films on the surfaces of the nano particles.
12 . The method of claim 11 , wherein the characteristics of the substrate are thermal conductivity, and when the thermal conductivity is 1 W/mK or more, it is determined that it is necessary to form oxide films on the surfaces of the nano particles.
13 . The method of claim 11 , wherein when the substrate comprises silicon, it is determined that it is necessary to form oxide films on the surfaces of the nano particles.
14 . A method for manufacturing a photonic sintering target, the method comprising:
determining whether it is necessary to form oxide films on the surfaces of the nano particles according to the characteristics of the substrate, on which the nano particles are to be formed; when it is necessary to form oxide films on the surfaces of the nano particles, forming oxide films on the surfaces of the nano particles; and manufacturing a conductive target by providing a binder resin in the nano particles, on which the oxide films are formed.
15 . The method of claim 14 , wherein the characteristics of the substrate are thermal conductivity, and when the thermal conductivity is 1 W/mK or more, it is determined that it is necessary to form oxide films on the surfaces of the nano particles.
16 . The method of claim 14 , wherein when the substrate comprises silicon, it is determined that it is necessary to form oxide films on the surfaces of the nano particles.
17 . A photonic sintering method, comprising:
determining whether it is necessary to form oxide films on the surfaces of the nano particles according to the characteristics of the substrate, on which the nano particles are to be formed; when it is necessary to form oxide films on the surfaces of the nano particles, forming oxide films on the surfaces of the nano particles; manufacturing a conductive target by providing a binder resin in the nano particles, on which the oxide films are formed; forming the manufactured conductive target on the substrate; and photonic-sintering the conductive target formed on the substrate.Cited by (0)
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