Systems, devices and methods related to shielded modules

Abstract

Systems, devices and methods related to shielded modules. In some embodiments, a module processing system can include a first sub-system configured to prepare or provide a carrier assembly that includes a ring having an inner boundary and configured to be utilized in a deposition apparatus, and a stencil having a plurality of openings, with each opening dimensioned to receive a portion of a packaged module. The carrier assembly can further include an adhesive member that attaches the stencil to the ring such that the stencil is positioned at least partially within the inner boundary of the ring, to allow the carrier assembly to be utilized in the deposition apparatus. The system can further include a second sub-system configured to position a plurality of packaged modules over the respective openings of the stencil to thereby allow the plurality of packaged modules to be processed in the deposition apparatus.

What is claimed is: 
     
         1 . A system for processing packaged modules, comprising:
 a first sub-system configured to prepare or provide a carrier assembly that includes a ring configured to be utilized in a deposition apparatus, a stencil assembly having a plurality of openings, each opening dimensioned to receive a portion of a packaged module to be processed, and an adhesive member that attaches the stencil assembly to the ring to allow the stencil assembly to be utilized in the deposition apparatus; and   a second sub-system configured to handle a plurality of packaged modules, such that the packaged modules are positioned over the openings of the stencil assembly and held by the stencil assembly to thereby allow the plurality of packaged modules to be processed further in the deposition apparatus.