Apparatus and methods for tracking administering of medication by medication injection devices

Abstract

A method of manufacturing a plunger head for a medication injection device includes assembling at least a portion of a first component, assembling at least a portion of a second component, and assembling the first component into a cavity of the second component. The first component has a distal end and a proximal end, the distal end being configured for insertion into a barrel of the medication injection device before the proximal end, and the first component houses at least one electronic component. The second component is configured to at least partially surround the first component and to separate the first component from a medication contained within the barrel of the medication injection device.

1 . A method of manufacturing a plunger head for a medication injection device, the method comprising:
 assembling at least a portion of a first component that houses at least one electronic component and has a distal end and a proximal end, the distal end being configured for insertion into a barrel of the medication injection device before the proximal end;   assembling at least a portion of a second component having a cavity and being configured to at least partially surround the first component and to separate the first component from a medication contained within the barrel of the medication injection device; and   assembling the first component into the cavity of the second component.   
     
     
         2 . The method of  claim 1 , wherein the at least one electronic component includes a transducer and a microcontroller coupled to the transducer, the microcontroller being located between the transducer and the proximal end, the transducer being configured to emit ultrasonic signals into the barrel of the medication injection device so that the ultrasonic signals travel along the barrel to an end of the barrel and return to the transducer when the plunger head is placed within the medication injection device. 
     
     
         3 . The method of  claim 2 , wherein assembling at least a portion of the first component includes positioning the transducer proximate to a bottom side of the distal end of the first component. 
     
     
         4 . The method of  claim 2 , wherein assembling at least a portion of the first component includes pre-assembling the transducer and the microcontroller, and then encapsulating the transducer and the microcontroller in a polymer before assembling the first component into the cavity of the second component. 
     
     
         5 . The method of  claim 2 , wherein assembling at least a portion of the first component includes pre-assembling the transducer and the microcontroller, and wherein assembling the first component into the cavity of the second component includes inserting the pre-assembled transducer and microcontroller into the cavity of the second component. 
     
     
         6 . The method of  claim 2 , wherein assembling the first component into the cavity of the second component includes sealing the first component within the cavity of the second component with a third component. 
     
     
         7 . The method of  claim 2 , wherein assembling the first component into the cavity of the second component includes backfilling the cavity of the second component with a polymer. 
     
     
         8 . The method of  claim 7 , wherein assembling the first component into the cavity of the second component includes sealing the first component within the cavity of the second component with a third component. 
     
     
         9 . The method of  claim 2 , wherein assembling at least a portion of the first component includes positioning a power source in the first component such that a compressive force applied to the first component can move the power source into electrical communication with the transducer, thereby causing the power source to electrically power the transducer. 
     
     
         10 . The method of  claim 1 , wherein assembling at least a portion of the first component comprises one or more lower-temperature steps, and assembling at least a portion of the second component comprises one or more higher-temperature steps, wherein the one or more lower-temperature steps occur at or below an electronic component temperature threshold. 
     
     
         11 . The method of  claim 10 , wherein the electronic component temperature threshold is about 60 degrees Celsius. 
     
     
         12 . The method of  claim 10 , wherein the one or more lower-temperature steps include assembling the at least one electronic component housed in the first component. 
     
     
         13 . The method of  claim 10 , wherein the one or more lower-temperature steps include sterilizing the first component and the one or more higher-temperature steps include sterilizing the second component. 
     
     
         14 . The method of  claim 1 , wherein assembling at least a portion of the first component includes pre-assembling the at least one electronic component in a structural support system and then encapsulating the at least one electronic component and the structural support system in a polymer. 
     
     
         15 . The method of  claim 1 , wherein the second component at least partially houses at least one other electronic component. 
     
     
         16 . The method of  claim 15 , wherein assembling the first component into the cavity of the second component includes making contact between the at least one electronic component housed in the first component and the at least one other electronic component housed in the second component. 
     
     
         17 . The method of  claim 16 , wherein assembling the first component into the cavity of the second component includes making contact between a power source housed in the first component and a contact of the at least one other electronic component housed in the second component, wherein the contact protrudes from the second component. 
     
     
         18 . The method of  claim 1 , wherein assembling at least a portion of the second component includes molding the second component into a bucket shape, wherein the cavity is at least partially defined by a bottom portion and a radially outer portion of the second component. 
     
     
         19 . The method of  claim 18 , wherein assembling the first component into the cavity of the second component includes positioning the first component within the cavity such that the bottom portion of the second component abuts a bottom side of the distal end of the first component. 
     
     
         20 . A method of manufacturing a plunger head for a medication injection device, comprising:
 assembling a first component of the plunger head using lower-temperature assembly steps, the first component housing at least one electronic component;   sterilizing the first component using a lower-temperature sterilization method;   assembling a second component of the plunger head using higher-temperature assembly steps;   sterilizing the second component using a higher-temperature sterilization method; and   attaching the first component to the second component,   wherein the lower-temperature assembly steps and lower-temperature sterilization method occur at or below an electronic component temperature threshold.