Multi-stage resin surface etching method, and plating method on resin using same

Abstract

A novel technique that is a resin etching technique without using chromic acid and can be operated at an industrial level is provided by a resin surface etching method characterized in that, in etching a resin surface, one set of the following steps (a) and (b) is performed two or more times without performing a resin swelling step: (a) a step of treating the resin surface with a solution containing an oxidizing agent and adsorbing the oxidizing agent on the resin surface, and (b) a step of activating the oxidizing agent adsorbed on the resin surface in the step (a).

1 : A resin surface etching method, wherein, in etching a resin surface, one of steps (a) and (b) is performed two or more times without performing a resin swelling step:
 (a) a step of treating the resin surface with a solution comprising an oxidizing agent and adsorbing the oxidizing agent on the resin surface; and   (b) a step of activating the oxidizing agent adsorbed on the resin surface in the step (a).   
     
     
         2 : The resin surface etching method according to  claim 1 , wherein each of the steps (a) and (b) is performed for 30 seconds or more. 
     
     
         3 : The resin surface etching method according to  claim 1 , wherein the oxidizing agent used in the step (a) is permanganic acid or a salt thereof. 
     
     
         4 : The resin surface etching method according to  claim 1 , wherein the activation of the oxidizing agent in the step (b) is performed by a treatment with a solution comprising one or more types of activating agents selected from the group consisting of an inorganic acid, an organic acid, hydrogen peroxide, a halogen oxoacid, a halogen oxoacid salt, and a persulfate. 
     
     
         5 : The resin surface etching method according to  claim 1 , wherein the activation of the oxidizing agent in the step (b) is performed by a treatment with a solution comprising one or more types of activating agents selected from the group consisting of sulfuric acid, phosphoric acid, hydrochloric acid, nitric acid, methanesulfonic acid, hydrogen peroxide, peroxodisulfate, periodic acid, perchloric acid, and perbromic acid. 
     
     
         6 : A plating method on a resin, wherein, in plating a resin, the plating is performed after the resin is etched by the resin surface etching method according to  claim 1  without performing a resin swelling step.