Thermosyphon

Abstract

A thermosiphon applied to a moving body includes a condenser and a plurality of coolers. Each of the plurality of coolers includes a first flow channel forming member, a second flow channel forming member, and a third flow channel forming member. The second flow channel forming member defines a refrigerant inlet that is located below a center portion of a supply flow channel defined by the first flow channel forming member in a vertical direction. The plurality of coolers are arranged along a traveling direction of the moving body and the supply flow channel is fluidly connected in series with each other.

1 . A thermosiphon applied to a moving body, comprising:
 a condenser condensing a gas-phase refrigerant and discharging a liquid-phase refrigerant; and   a plurality of coolers that evaporate the liquid-phase refrigerant from the condenser, the refrigerant circulating between the condenser and the plurality of coolers, wherein   each of the plurality of coolers includes:
 a first flow channel forming member that defines a supply flow channel through which the liquid-phase refrigerant from the condenser flows; 
 a second flow channel forming member that defines a refrigerant inlet in communication with the supply flow channel, the second flow channel forming member extending upward from the refrigerant inlet to define an evaporation flow channel in which the liquid-phase refrigerant evaporates through heat exchange between an object to be cooled and the liquid-phase refrigerant flowing into the evaporation flow channel from the supply flow channel through the refrigerant inlet and generates the gas-phase refrigerant; and 
 a third flow channel forming member that defines a discharge flow channel through which the gas-phase refrigerant from the evaporation flow channel flows toward the condenser, wherein 
   the refrigerant inlet is located below a center portion of the supply flow channel in a vertical direction, and   the plurality of coolers are arranged along a traveling direction of the moving body and the supply flow channel of each of the plurality of coolers is fluidly connected in series with each other so that the liquid-phase refrigerant is sequentially supplied to the supply flow channel of each of the plurality of coolers.   
     
     
         2 . The thermosiphon according to  claim 1 , wherein
 the refrigerant inlet is located below the supply flow channel.   
     
     
         3 . The thermosiphon according to  claim 1 , further comprising
 at least one liquid storage that is recessed downward from the supply flow channel to store the liquid-phase refrigerant from the supply flow channel.   
     
     
         4 . A thermosiphon applied to a moving body, comprising:
 a condenser condensing a gas-phase refrigerant and discharging a liquid-phase refrigerant; and   a plurality of coolers that evaporate the liquid-phase refrigerant from the condenser, the refrigerant circulating between the condenser and the plurality of coolers, wherein   each of the plurality of coolers includes:
 a first flow channel forming member that defines a supply flow channel through which the liquid-phase refrigerant from the condenser flows; 
 a second flow channel forming member that defines a refrigerant inlet into which the liquid-phase refrigerant from the supply flow channel flows, the second flow channel forming member defining an evaporation flow channel in which the liquid-phase refrigerant evaporates through heat exchange between an object to be cooled and the liquid-phase refrigerant flowing into the evaporation flow channel through the refrigerant inlet and through which the gas-phase refrigerant flows toward the condenser; 
 a third flow channel forming member that defines a discharge flow channel through which the gas-phase refrigerant from the evaporation flow channel flows toward the condenser, and 
   at least one liquid storage that is recessed downward from the supply flow channel to store the liquid-phase refrigerant from the supply flow channel, wherein   the refrigerant inlet is in communication with the at least one liquid storage,   the refrigerant inlet is located at the same height as a liquid surface of the liquid-phase refrigerant in the at least one liquid storage or is located below the liquid surface, and   the plurality of coolers are arranged along a traveling direction of the moving body and the supply flow channel of each of the plurality of coolers is fluidly connected in series with each other so that the liquid-phase refrigerant is sequentially supplied to the supply flow channel of each of the plurality of coolers.   
     
     
         5 . The thermosiphon according to  claim 1 , wherein
 the evaporation flow channel is a plurality of evaporation flow channels arranged along a refrigerant flow direction of the supply flow channel,   the at least one liquid storage is a plurality of liquid storages arranged along the refrigerant flow direction of the supply flow channel, and   each of the plurality of liquid storages is in communication with the refrigerant inlet of a corresponding one of the plurality of evaporation flow channels.   
     
     
         6 . The thermosiphon according to  claim 1 , wherein
 the evaporation flow channel has a flow channel cross-sectional area that is smaller than a flow channel cross-sectional area of the supply flow channel.   
     
     
         7 . The thermosiphon according to  claim 1 , wherein
 the evaporation flow channel includes a plurality of narrow flow channels, and   each of the plurality of narrow flow channels has a flow channel cross-sectional area that is smaller than a flow channel cross-sectional area of the supply flow channel.   
     
     
         8 . A thermosiphon applied to a moving body, comprising:
 a condenser that condenses a gas-phase refrigerant and discharges a liquid-phase refrigerant, and   a plurality of coolers that evaporate the liquid-phase refrigerant from the condenser, the refrigerant circulating between the condenser and the plurality of coolers, wherein   each of the plurality of coolers includes:
 a first flow channel forming member that defines a supply flow channel through which the liquid-phase refrigerant from the condenser flows; 
 a second flow channel forming member that defines an evaporation flow channel in which the liquid-phase refrigerant evaporates through heat exchange between an object to be cooled and the liquid-phase refrigerant from the supply flow channel and generates the gas-phase refrigerant; and 
 a third flow channel forming member that defines a discharge flow channel through which the gas-phase refrigerant from the evaporation flow channel flows toward the condenser, and 
   the plurality of coolers are arranged along a traveling direction of the moving body and the supply flow channel of each of the plurality of coolers is fluidly connected in series with each other so that the liquid-phase refrigerant is sequentially supplied to the supply flow channel of each of the plurality of coolers.   
     
     
         9 . The thermosiphon according to  claim 8 , wherein
 the supply flow channel of each of the plurality of coolers extends along the traveling direction of the moving body.   
     
     
         10 . The thermosiphon according to  claim 8 , further comprising:
 a bypass flow channel forming member that defines a bypass flow channel; and   an on-off valve that selectively opens and closes the bypass flow channel, wherein   one of two coolers among the plurality of coolers located in front of the other of the two coolers in the traveling direction is defined as a first cooler,   the other of the two coolers located behind the first cooler in the traveling direction is defined as a second cooler,   the first cooler has a first refrigerant inlet that allows the liquid-phase refrigerant to flow into the supply flow channel,   the second cooler has a second refrigerant inlet that allows the liquid-phase refrigerant to flow into the supply flow channel,   the bypass flow channel fluidly connects between the first refrigerant inlet of the first cooler and the second refrigerant inlet of the second cooler to bypass the first cooler,   when the plurality of coolers are in a specified posture, the on-off valve opens the bypass flow channel so that a first portion of the liquid-phase refrigerant from the condenser is supplied to the supply flow channel of the first cooler through the first refrigerant inlet and a second portion of a remaining of the liquid-phase refrigerant from the condenser other than the second portion of the liquid-phase refrigerant is supplied to the supply flow channel of the second cooler through the bypass flow channel, the on-off valve, and the second refrigerant inlet, and   when the plurality of coolers are in a posture angled with respect to the specified posture, the on-off valve closes the bypass flow channel so that the liquid-phase refrigerant from the condenser is supplied to the first refrigerant inlet, the supply flow channel of the first cooler, the second refrigerant inlet, and the supply flow channel of the second cooler in this order.   
     
     
         11 . The thermosiphon according to  claim 8 , wherein
 the supply flow channel of each of the plurality of coolers extends along a direction intersecting with the traveling direction of the moving body.   
     
     
         12 . The thermosiphon according to  claim 8 , further comprising:
 a bypass flow channel forming member that defines a bypass flow channel;   a communication flow channel forming member that defines a communication flow channel; and   an on-off valve that selectively opens and closes the bypass flow channel, wherein   one of two coolers of the plurality of coolers located in front of the other of two coolers in the traveling direction is defined as a first cooler,   the other of the two coolers located behind the first cooler in the traveling direction is defined as a second cooler,   the first cooler has a refrigerant inlet that allows the liquid-phase refrigerant to flow into the supply flow channel and a refrigerant outlet that allows the liquid-phase refrigerant to be discharged from the supply flow channel,   the second cooler has a first refrigerant inlet and a second refrigerant inlet both of which allow the liquid-phase refrigerant to flow into the supply flow channel,   the communication flow channel fluidly connects between the refrigerant outlet of the first cooler and the second refrigerant inlet of the second cooler,   the bypass flow channel fluidly connects between the refrigerant inlet of the first cooler and the second refrigerant inlet of the second cooler to bypass the first cooler and the second cooler,   when the plurality of coolers are in a specified posture, the on-off valve opens the bypass flow channel so that a first portion of the liquid-phase refrigerant from the condenser is supplied to the supply flow channel of the first cooler through the refrigerant inlet and a second portion of a remaining of the liquid-phase refrigerant from the condenser other than the first portion of the liquid-phase refrigerant is supplied to the supply flow channel of the second cooler through the bypass flow channel and the on-off valve, and   when the plurality of coolers are in a posture angled with respect to the specified posture, the on-off valve closes the bypass flow channel so that the liquid-phase refrigerant from the condenser is supplied to the refrigerant inlet, the supply flow channel of the first cooler, the communication flow path, and the supply flow channel of the second cooler in this order.   
     
     
         13 . The thermosiphon according to  claim 8 , wherein
 the evaporation flow channel of each of the plurality of coolers has a refrigerant inlet in communication with the supply flow channel, and   the refrigerant inlet is located below a center portion of the supply flow channel in a vertical direction.   
     
     
         14 . The thermosiphon according to  claim 13 , wherein
 the refrigerant inlet is located below the supply flow channel.   
     
     
         15 . The thermosiphon according to  claim 8 , wherein
 the evaporation flow channel of each of the plurality of coolers has a refrigerant inlet in communication with the supply flow channel,   each of the plurality of coolers has a liquid storage that is recessed downward from the supply flow channel and stores the liquid-phase refrigerant from the supply flow channel, and   the refrigerant inlet of the evaporation flow path of each of the plurality of coolers is in communication with the liquid storage of each of the plurality of coolers, and   the refrigerant inlet of the evaporation flow path of each of the plurality of coolers is located at the same height as a liquid surface of the liquid-phase refrigerant in the liquid storage of each of the plurality of coolers or is located below the liquid surface.   
     
     
         16 . The thermosiphon according to  claim 8 , further comprising
 a processor programmed to:
 determine whether the plurality of coolers are angled with respect to a specified posture; and 
 upon determining that the plurality of coolers are in a posture angled with respect to the specified posture, increase a refrigerant amount of the liquid-phase refrigerant supplied from the condenser to the plurality of coolers as compared with when determining that the coolers are not in a posture angled with respect to the specified posture. 
   
     
     
         17 . The thermosiphon according to  claim 8 , wherein
 the evaporation flow channel of each of the plurality of coolers has a flow channel cross-sectional area that is smaller than a flow channel cross-sectional area of the supply flow channel.   
     
     
         18 . The thermosiphon according to  claim 8 , wherein
 the evaporation flow channel of each of the plurality of coolers has a plurality of narrow flow channels, and   each of the plurality of narrow flow channels has a flow channel cross-sectional area smaller than the flow channel cross-sectional area of the supply flow channel.   
     
     
         19 . A thermosiphon comprising:
 a condenser that condenses a gas-phase refrigerant and discharges a liquid-phase refrigerant;   a cooler that evaporates the liquid-phase refrigerant through heat exchange between an object to be cooled and the liquid-phase refrigerant flowing into the cooler from the condenser and discharges the gas-phase refrigerant to the condenser, the refrigerant circulating between the condenser and the cooler; and   a processor that is programmed to:
 determine whether the cooler is angled with respect to a specified posture; and 
 upon determining that the cooler is in a posture angled with respect to the specified posture, increase a refrigerant amount of the liquid-phase refrigerant supplied from the condenser to the cooler as compared with when determining that the cooler is not in a posture angled with respect to the specified posture. 
   
     
     
         20 . The thermosiphon according to  claim 19 , wherein
 the cooler comprises:
 a first flow channel forming member that defines a supply flow channel through which the liquid-phase refrigerant from the condenser flows; 
 a second flow channel forming member that defines a refrigerant inlet in communication with the supply flow channel, the second flow channel forming member defining an evaporation flow channel in which the liquid-phase refrigerant evaporates through heat exchange between an object to be cooled and the liquid-phase refrigerant flowing into the evaporation flow channel from the supply flow channel through the refrigerant inlet and generates the gas-phase refrigerant; and 
 a third flow channel forming member that defines a discharge flow channel through which the gas-phase refrigerant from the evaporation flow channel flows toward the condenser. 
   
     
     
         21 . The thermosiphon according to  claim 20 , wherein
 the refrigerant inlet is located below the center portion of the supply flow channel in the vertical direction.   
     
     
         22 . The thermosiphon according to  claim 20 , wherein
 the refrigerant inlet is located below the supply flow channel.   
     
     
         23 . The thermosiphon according to  claim 20 , wherein
 the cooler includes at least one liquid storage recessed downward from the supply flow channel and storing the liquid-phase refrigerant from the supply flow channel.   
     
     
         24 . The thermosiphon according to  claim 23 , wherein
 the refrigerant inlet is in communication with the at least one liquid storage, and   the refrigerant inlet is located at the same height as a liquid surface of the liquid-phase refrigerant in the at least one liquid storage or is located below the liquid surface.   
     
     
         25 . The thermosiphon according to  claim 20 , wherein
 the at least one liquid storage includes a plurality of liquid storages arranged along the refrigerant flow direction of the supply flow channel,   the cooler defines, as the evaporation flow channel, a plurality of evaporation flow channels arranged along a refrigerant flow direction of the supply flow channel, and   each of the plurality of liquid storages is in communication with a refrigerant inlet of a corresponding one of the plurality of evaporation flow channels.   
     
     
         26 . The thermosiphon according to  claim 20 , wherein
 the evaporation flow channel has a flow channel cross-sectional area that is smaller than a flow channel cross-sectional area of the supply flow channel.   
     
     
         27 . The thermosiphon according to  claim 20 , wherein
 the evaporation flow channel has a plurality of narrow flow paths, and   each of the plurality of narrow flow paths has a flow channel cross-sectional area smaller than a flow channel cross-sectional area of the supply flow channel.