US2020091890A1PendingUtilityA1

Stacked wafer-level packaging devices

Assignee: SKYWORKS SOLUTIONS INCPriority: Jul 7, 2015Filed: Aug 26, 2019Published: Mar 19, 2020
Est. expiryJul 7, 2035(~8.9 yrs left)· nominal 20-yr term from priority
H04B 1/04H04B 1/48H03H 9/706H03H 9/0566H03H 9/725H04B 1/16H03H 9/46H10W 90/28H10W 42/276H10W 70/682H10W 70/681H10W 72/0198H10W 90/20H10W 42/271H10W 72/884H10W 72/877H10W 90/754H10W 90/759H10W 44/255H10W 90/00H10W 72/074H10W 72/073H10W 72/07236H10W 90/724H10W 90/732H01L 23/3114H01L 23/552H01L 23/49833H01L 23/49838H01L 25/0657H01L 24/97H01L 23/66H10W 90/401H10W 72/072H10W 74/129H10W 70/65H10W 44/20H10W 42/20
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Claims

Abstract

Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device. The wireless device further includes an antenna in communication with the front-end module, the antenna configured to transmit the amplified radio-frequency signal.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A wireless device comprising:
 a transceiver configured to generate a radio-frequency (RF) signal;   a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device; and   an antenna in communication with the front-end module, the antenna configured to transmit the amplified radio-frequency signal.

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