Composite containing poly(glycerol sebacate) filler

Abstract

A filler material of a thermoset resin of a diacid/polyol, such as PGS is provided. The filler useful in forming composites, such as those in which the filler and a resin matrix are of the same material to provide a homogenous polymeric composition. Composites in which at least one of the matrix, the filler or both are PGS are also provided. Methods of forming such filler materials and composites are also disclosed. The composites allow extrusion process to form articles from materials that would not otherwise be capable of being extruded.

What is claimed is: 
     
         1 . A filler material comprising particles of a thermoset resin of a polymer that comprises a condensation reaction product of a diacid and a polyol and having a particle size between 0.5 and 1000 microns. 
     
     
         2 . The filler material of  claim 1 , having a particle size between 0.5 and 300 microns. 
     
     
         3 . The filler material of  claim 1 , wherein the filler material is a thermoset resin of polymer of glycerol/sebacic acid (PGS). 
     
     
         4 . The filler material of  claim 3 , wherein the PGS has a molar ratio of glycerol to sebacic acid in the range of 0.7:1 to 1.3:1. 
     
     
         5 . The filler material of  claim 4 , wherein the PGS has a molar ratio of glycerol to sebacic acid of 1:1. 
     
     
         6 . The filler material of  claim 3 , wherein the PGS has a cross-link density of about 0.07 mol/L or greater. 
     
     
         7 . The filler material of  claim 1 , wherein the thermoset resin is doped with an active ingredient. 
     
     
         8 . A method of forming a filler material, the method comprising:
 providing a thermoset material comprising polymer of glycerol/sebacic acid (PGS); and   forming particles of the thermoset material having a particle size between 0.5 and 1000 microns.   
     
     
         9 . The method of  claim 8 , wherein the step of forming comprises cryogrinding the thermoset material. 
     
     
         10 . The method of  claim 9 , wherein the particles of the thermoset material have a particle size between 0.5 and 300 microns. 
     
     
         11 . The method of  claim 8 , wherein the step of forming comprises soaking the thermoset material in a solvent to dissolve low molecular weight fractions and thereafter milling the thermoset material. 
     
     
         12 . The method of  claim 11 , wherein the solvent is an organic solvent selected from the group consisting of ethyl acetate and tetrahydrofuran. 
     
     
         13 . The method of  claim 8  further comprising sizing the particles of the thermoset material. 
     
     
         14 . The method of  claim 13 , wherein the sizing comprises sieving. 
     
     
         15 . The method of  claim 8 , wherein the step of forming particles comprises soaking the thermoset material in a solvent to dissolve low molecular weight fractions and thereafter agitating the thermoset material to crumble the thermoset material into the particles. 
     
     
         16 . The method of  claim 8 , wherein the thermoset material is doped with an active ingredient. 
     
     
         17 . The method of  claim 8  further comprising curing a resin of PGS to form the thermoset material. 
     
     
         18 . The method of  claim 17  further comprising loading the resin of PGS with an active ingredient prior to curing the resin of PGS.