Led packaging with integrated optics and methods of manufacturing the same

Abstract

Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.

What is claimed is: 
     
         1 . An array of LED die formed on a common packaging substrate comprising:
 metal contacts formed on a front side of the common packaging substrate, wherein the metal contacts are electrically connected to leads formed on one of the front side and a back side of the substrate;   a plurality of LED die mounted on the front side of the substrate to form the array, each LED die being in electrical contact with at least one of the metal contacts on the substrate; and   a laminated array of micro-mirror reflectors surrounding the LEDs, wherein each micro-mirror reflector in the array surrounds one or more of the LED die mounted on the substrate and the micro-mirror reflector and wherein each micro-mirror reflector comprises a smooth curved surface.   
     
     
         2 . The array of  claim 1 , wherein each micro-mirror reflector in the array surrounds a single LED. 
     
     
         3 . The array of  claim 1 , further comprising an array of encapsulations, wherein each encapsulation encapsulates one or more of the LED die mounted on the substrate. 
     
     
         4 . The array of  claim 1 , wherein each encapsulation encapsulates a single LED. 
     
     
         5 . The array of  claim 4 , wherein each encapsulation forms a lens profile shaped to concentrate light from the LED die in the front direction. 
     
     
         6 . The array of  claim 1 , wherein the leads comprise one of stud bumps and solder bumps. 
     
     
         7 . The array of  claim 1 , wherein the LED die are wirebonded to at least one metal contact on the substrate. 
     
     
         8 . The array of  claim 1 , wherein the common packaging substrate comprises integrated logic for interacting with the LED die. 
     
     
         9 . The array of  claim 1 , wherein the common packaging substrate is a thermally conductive packaging substrate comprising a material selected from Si, BeO, AlN, a thermally conductive ceramic, and a thermally conductive polymer. 
     
     
         10 . An encapsulated LED having a front side for emitting light comprising:
 an LED mounted onto a packaging substrate, the packaging substrate comprising electrically conductive contacts in electrical connection with the LED and electrical leads electrically connected to the conductive contacts, wherein the conductive contacts are in electrical communication with the electrical leads through electrical traces formed in the substrate; and   a molded encapsulation in front of the LED, the molded encapsulation encapsulating the LED and a portion of the packaging substrate surrounding the LED.   
     
     
         11 . The LED of  claim 10 , wherein the molded encapsulation forms a concentrator lens profile in front of the LED. 
     
     
         12 . The LED of  claim 10 , wherein the molded encapsulation has sidewalls surfaces flush with sidewall surfaces of the packaging substrate. 
     
     
         13 . The LED of  claim 10 , further comprising a laminated micro-mirror reflector housing surrounding the molded encapsulation material. 
     
     
         14 . The LED of  claim 13 , wherein the laminated micro-mirror reflector housing comprises a metallized surface of a molded polymer. 
     
     
         15 . The LED of  claim 14 , wherein the molded polymer has sidewalls surfaces flush with sidewall surfaces of the packaging substrate. 
     
     
         16 . The LED of  claim 13 , wherein the laminated micro-mirror reflector housing comprises a smoothly curved reflective surface. 
     
     
         17 . The LED of  claim 10 , wherein the packaging substrate is a thermally conductive packaging substrate comprising a material selected from Si, BeO, AlN, a thermally conductive ceramic, and a thermally conductive polymer. 
     
     
         18 . The LED of  claim 10 , wherein the packaging substrate has low thermal conductivity and is mounted onto a heat sink. 
     
     
         19 . The LED of  claim 18 , wherein the packaging substrate comprises a molded substrate. 
     
     
         20 . The LED of  claim 10 , wherein the leads comprise one of stud bumps and solder bumps. 
     
     
         21 . The LED of  claim 10 , wherein the packaging substrate comprises integrated logic circuitry for interacting with the LED. 
     
     
         22 . The LED of  claim 21 , wherein the logic circuitry comprises a feedback circuitry integrated with a photodiode.