Thermodynamic ram technology stack

Abstract

A thermodynamic RAM technology stack, two or more memristors or pairs of memristors comprising AHaH (Anti-Hebbian and Hebbian) computing components, and one or more AHaH nodes composed of such memristor pairs to that forms at least a portion of the thermodynamic RAM technology stack. The levels of the thermodynamic-RAM technology stack include the memristor, a Knowm synapse, an AHaH Node, a kT-RAM, kT-RAM instruction set, a sparse spike encoding, a kT-RAM emulator, and a SENSE Server.

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         10 . A thermodynamic RAM application server, comprising:
 a collection of one or more modules comprising:
 at least one machine learning module that executes thermodynamic RAM instruction set calls; 
 at least one spoke encoding algorithm; 
 at least one spoke pattern buffer; and 
 at least one spike stream joiner. 
   
     
     
         11 . The thermodynamic RAM application server of  claim 10 , wherein said thermodynamic RAM application server runs on a Linux operating system. 
     
     
         12 . The thermodynamic RAM application server of  claim 10  wherein said thermodynamic RAM is integrated with a CPU such that a thermodynamic RAM instruction set is specified as a part of a CPU instruction set. 
     
     
         13 . The thermodynamic RAM application server of  claim 12  wherein said thermodynamic RAM is integrated with said CPU via a north bridge. 
     
     
         14 . The thermodynamic RAM application server of  claim 12  wherein said thermodynamic RAM is integrated with said CPU via a south bridge. 
     
     
         15 . The thermodynamic RAM application server of  claim 12  wherein said thermodynamic RAM is integrated with said CPU via a PCI bus. 
     
     
         16 . The thermodynamic RAM application server of  claim 12  wherein said thermodynamic RAM is integrated with said CPU via an LPR bus.