Vapor chamber based on flat plate loop heat pipe

Abstract

The present disclosure discloses a vapor chamber based on a flat plate loop heat pipe. The flat plate loop heat pipe composed of an evaporator, a reservoir and a gas/liquid line is pre-buried in an aluminum alloy plate, so as to form the vapor chamber based on the flat plate loop heat pipe. The evaporator of the flat plate loop heat pipe is arranged in a region, attached to a biggest heat source of a chip to be subjected to heat dissipation, on the vapor chamber, and the side, provided with a vapor channel, of the evaporator is attached to the biggest heat source.

1 . A vapor chamber based on a flat plate loop heat pipe, wherein the vapor chamber is attached to heat sources, comprising:
 a heat spreading plate; and   a flat plate loop heat pipe composed of an evaporator, a reservoir and a gas/liquid line;   wherein the flat plate loop heat pipe is pre-buried in the heat spreading plate; wherein the evaporator is arranged on the heat spreading plate at the position of attachment to the biggest heat source in the heat sources; wherein the reservoir is used to supply liquid to the evaporator; positions on the heat spreading plate that are attached to other heat sources except the biggest heat source in the heat sources are used as “heat source attached regions”, and positions on the heat spreading plate that are not attached to the heat sources are used as “heat sink attached regions”; wherein the gas/liquid line leading out from an outlet of the evaporator is disposed in a meandering fashion between the “heat source attached regions” and the “heat sink attached regions” on the heat spreading plate, so that a liquid working fluid enters the “heat sink attached regions” after absorbing heat of the “heat source attached regions” and being evaporated into vapor, and a gas working fluid releases heat in the “heat sink attached regions” and is condensed into liquid; and circulation is performed hereby, and the working fluid finally flows back into the reservoir after being condensed by the “heat sink attached regions” into liquid, thus forming a loop.   
     
     
         2 . The vapor chamber based on the flat plate loop heat pipe according to  claim 1 , wherein cold sources are arranged in the “heat sink attached regions” on one side or two sides of the heat spreading plate; and the gas/liquid line leading out from the outlet of the evaporator is disposed in a meandering fashion between the “heat sink attached regions” and the “heat source attached regions” on the heat spreading plate. 
     
     
         3 . The vapor chamber based on the flat plate loop heat pipe according to  claim 1 , wherein the liquid reservoir is suspended, and is not connected with the heat spreading plate in a heat conduction manner. 
     
     
         4 . The vapor chamber based on the flat plate loop heat pipe according to  claim 1 , wherein the evaporator is exposed and directly attached to the biggest heat source in the heat sources. 
     
     
         5 . The vapor chamber based on the flat plate loop heat pipe according to  claim 1 , wherein the gas/liquid line is formed by a copper, stainless steel or titanium alloy pipeline sheet metal, and pre-buried in the heat spreading plate in a gluing or welding manner. 
     
     
         6 . The vapor chamber based on the flat plate loop heat pipe according to  claim 1 , wherein the heat spreading plate is an aluminum alloy plate. 
     
     
         7 . The vapor chamber based on the flat plate loop heat pipe according to  claim 2 , wherein the liquid reservoir is suspended, and is not connected with the heat spreading plate in a heat conduction manner. 
     
     
         8 . The vapor chamber based on the flat plate loop heat pipe according to  claim 2 , wherein the evaporator is exposed and directly attached to the biggest heat source in the heat sources. 
     
     
         9 . The vapor chamber based on the flat plate loop heat pipe according to  claim 2 , wherein the gas/liquid line is formed by a copper, stainless steel or titanium alloy pipeline sheet metal, and pre-buried in the heat spreading plate in a gluing or welding manner. 
     
     
         10 . The vapor chamber based on the flat plate loop heat pipe according to  claim 2 , wherein the heat spreading plate is an aluminum alloy plate.