Procedure for the manufacturing of nanostructured platinum

Abstract

A method for the manufacturing of platinum nanostructures showing improved properties and usable in biomedical appliances is provided. The method includes providing a solution containing hexachloroplatinate with the remainder being water and electrochemical deposition of platinum on a substrate with the platinum deposited in a nanostructured form.

What is claimed is: 
     
         1 . A method for the manufacturing of nanostructured platinum, the method comprising:
 providing a solution containing hexachloroplatinate with the remainder water; and   electrochemically depositing platinum on a substrate, wherein the platinum is deposited in a nanostructured form.   
     
     
         2 . The method according to  claim 1 , wherein the solution comprises a pH-value between approximately 1.5 and approximately 4.4. 
     
     
         3 . The method according to  claim 1 , wherein a concentration of hexachloroplatinate is between approximately 0.2 mM and approximately 3.1 mM. 
     
     
         4 . The method according to  claim 1 , wherein the electrochemical deposition is carried out in a voltage range between approximately −0.4 V and approximately +0.4 V vs. Ag/AgCl. 
     
     
         5 . The method according to  claim 1 , wherein the electrochemical deposition is carried out as a dynamic potential deposition. 
     
     
         6 . The method according to  claim 5 , wherein the electrochemical deposition is carried out by a single sweep. 
     
     
         7 . The method according to  claim 5 , wherein the electrochemical deposition is carried out by multiple sweeps in a given potential range. 
     
     
         8 . The method according to  claim 1 , wherein a grain size of the deposited platinum is in a range between approximately 1 nm to approximately 500 nm. 
     
     
         9 . The method according to  claim 1 , wherein a grain size of the deposited platinum is in a range between approximately 5 nm to approximately 400 nm. 
     
     
         10 . The method according to  claim 1 , wherein a grain size of the deposited platinum is in a range between approximately 10 nm to approximately 200 nm 
     
     
         11 . The method according to  claim 1 , wherein the electrochemical deposition of the platinum on the substrate comprises a dynamic potential process with multiple sweeps in a potential range between approximately 1 mV/s and approximately 200 mV/s. 
     
     
         12 . The method according to  claim 11 , wherein the potential range is between approximately 2 mV/s and approximately 150 mV/s. 
     
     
         13 . The method according to  claim 1 , wherein the electrochemical deposition of the platinum on the substrate comprises a total charge transferred between approximately 0.5 C/cm 2  and approximately 5 C/cm 2 . 
     
     
         14 . The method according to  claim 1 , wherein the electrochemical deposition of the platinum on the substrate comprises a total charge transferred between approximately 0.8 C/cm 2  and approximately 4 C/cm 2 . 
     
     
         15 . A method for the manufacturing of nanostructured platinum, the method comprising:
 preparing a solution containing between approximately 0.2 mM and approximately 3.1 mM hexachloroplatinate with the remainder being water, wherein the pH-value of the solution is between approximately 1.5 and approximately 4.4;   placing a substrate in the solution; and   electrochemically depositing platinum on the substrate using dynamic potential deposition in a voltage range between approximately −0.4 V and approximately +0.4 V vs. Ag/AgCl, wherein the deposited platinum comprises a grain size between approximately 5 nm to approximately 400 nm.   
     
     
         16 . The method according to  claim 15 , wherein electrochemically depositing the platinum on the substrate comprises multiple sweeps in a potential range between approximately 1 mV/s and approximately 200 mV/s. 
     
     
         17 . The method according to  claim 15 , wherein electrochemically depositing the platinum on the substrate comprises a total charge transferred between approximately 0.5 C/cm 2  and approximately 5 C/cm 2 . 
     
     
         18 . The method according to  claim 15 , wherein electrochemically depositing the platinum on the substrate comprises a deposition time between approximately 1 s and approximately 60 min. 
     
     
         19 . A method for the manufacturing of nanostructured platinum, the method comprising:
 preparing a solution containing between approximately 0.2 mM and approximately 3.1 mM hexachloroplatinate with the remainder being water, wherein the pH-value of the solution is between approximately 1.5 and approximately 4.4; and   electrochemically depositing platinum on a substrate using dynamic potential deposition in a voltage range between approximately −0.4 V and approximately +0.4 V vs. Ag/AgCl and a deposition time between approximately 10 s and approximately 360 s, wherein the deposited platinum comprises a grain size between approximately 10 nm to approximately 200 nm.   
     
     
         20 . The method according to  claim 19 , wherein electrochemically depositing the platinum on the substrate comprises multiple sweeps in a potential range between approximately 1 mV/s and approximately 200 mV/s.