Heat exchanger device

Abstract

A multilayer heat exchanger device comprising: a stack of plates arranged to provide multiple fluid flow paths separated by the plates; wherein at least some of the plates are pin fin plates that each have an array of pins extending outwards from the pin fin plate into the fluid flow paths; and wherein each pin comprises an inner end integrally formed with the pin fin plate, a mid-point along a longitudinal axis of the pin, and an outer end to be bonded to an adjacent plate; wherein the cross sectional area of the pin at the outer end is larger than the cross sectional area at the mid-point.

1 . A multilayer heat exchanger device comprising:
 a stack of plates arranged to provide multiple fluid flow paths separated by the plates;   wherein at least some of the plates are pin fin plates that each have an array of pins extending outwards from the pin fin plate into the fluid flow paths; and   wherein each pin comprises an inner end integrally formed with the pin fin plate, a mid-point along a longitudinal axis of the pin, an outer end to be bonded to an adjacent plate; and   wherein the cross sectional area of the pin at the outer end is larger than the cross sectional area at the mid-point.   
     
     
         2 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the array of pins is distributed across the body of the plate in a grid pattern. 
     
     
         3 . The multilayer heat exchanger device as claimed in  claim 2 , wherein the array of pins have the same distribution across the body of each plate within the stack of plates. 
     
     
         4 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the pins have a circular cross section. 
     
     
         5 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the cross sectional area of the outer end is larger than the cross sectional area of the inner end. 
     
     
         6 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the cross sectional area of the outer end is equal to the cross sectional area of the inner end. 
     
     
         7 . The multilayer heat exchanger device as claimed in  claim 1 , wherein any change in cross sectional area is linear along the longitudinal axis of the pin. 
     
     
         8 . The multilayer heat exchanger device as claimed in  claim 1 , wherein any change in cross sectional area is exponential along the longitudinal axis of the pin. 
     
     
         9 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the outer ends of the pins are bonded to the adjacent plate by brazing. 
     
     
         10 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the pins have a width in the range 0.5 to 5 mm. 
     
     
         11 . The multilayer heat exchanger device as claimed in  claim 1 , wherein a spacing between the pins is similar to the width of the pins. 
     
     
         12 . The multilayer heat exchanger device as claimed in  claim 1 , wherein a spacing between the pins is between 1 and 2 times a width of the pins. 
     
     
         13 . The multilayer heat exchanger device as claimed in  claim 1 , wherein a spacing between the pins is up to 5 times a width of the pins. 
     
     
         14 . The multilayer heat exchanger device as claimed in  claim 1 , wherein the increase in cross sectional area from the minimum point to the outer end is between 5% and 50%. 
     
     
         16 . The multilayer heat exchanger device as claimed in claim  15 , wherein the increase in cross sectional area from the minimum point to the outer end is between 5% and 50%. 
     
     
         17 . The multilayer heat exchanger device as claimed in  claim 16 , wherein the increase in cross sectional area from the minimum point to the outer end is between 20% and 30%. 
     
     
         18 . A method of manufacturing a multilayer heat exchanger device comprising:
 forming a pin fin plate to be arranged in a stack of plates, each pin fin plate having an array of heat exchanger pins extending outward from the pin fin plate to an outer end of the pin;   each pin comprising an inner end integrally formed with the plate and a mid-point between the inner and outer end;   wherein the cross sectional area of the pin is greater at the outer end than at the mid-point and wherein an adjacent plate is bonded to the pin at the outer end.   
     
     
         19 . The method as claimed in  claim 18 , wherein each pin fin plate is formed by a process of subtractive manufacturing. 
     
     
         20 . The method as claimed in  claim 18 , wherein each pin fin plate is formed by a process of additive manufacturing.