Electronic component

Abstract

An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

What is claimed is: 
     
         1 . An electronic component comprising:
 an element body formed of a ceramic;   an external electrode disposed on an outer surface of the element body; and   an internal conductor disposed in the element body, wherein   the external electrode has a first electrode layer electrically connected to the internal conductor, a second electrode layer disposed to cover the first electrode layer, and a third electrode layer disposed to cover the second electrode layer, and   a thermal conductivity of the second electrode layer is lower than a thermal conductivity of the first electrode layer.   
     
     
         2 . The electronic component according to  claim 1 , wherein
 a thermal conductivity of the third electrode layer is lower than a thermal conductivity of the first electrode layer.   
     
     
         3 . The electronic component according to  claim 1 , wherein
 the first electrode layer and the second electrode layer contain an identical metal component.   
     
     
         4 . The electronic component according to  claim 1 , wherein
 the first electrode layer and the second electrode layer are formed of different metal materials, and   the second electrode layer contains Ag.   
     
     
         5 . The electronic component according to  claim 1 , wherein
 the second electrode layer contains an identical metal component with respect to that of the first electrode layer and is formed of a non-identical metal component with respect to that of the third component.   
     
     
         6 . The electronic component according to  claim 1 , further comprising:
 a thin film layer disposed on the outer surface of the element body.   
     
     
         7 . The electronic component according to  claim 6 , wherein
 the thin film layer is formed of an amorphous glass coat.   
     
     
         8 . The electronic component according to  claim 6 , wherein
 the thin film layer contains Al.   
     
     
         9 . The electronic component according to  claim 6 , wherein
 the thin film layer is formed along a surface shape of the outer surface of the element body.   
     
     
         10 . The electronic component according to  claim 1 , wherein
 the element body has a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces,   the outer electrode is disposed near each of the pair of end surfaces, and   the first electrode layer has a thickness of a central portion that is smaller than a thickness of an end portion when viewed from a facing direction of the pair of end surfaces.   
     
     
         11 . The electronic component according to  claim 1 , wherein
 the element body has a pair of end surfaces facing each other and four side surfaces connecting the pair of end surfaces,   the outer electrode is disposed near each of the pair of end surfaces, and   the second electrode layer has a thickness of a central portion that is larger than a thickness of an end portion when viewed from a facing direction of the pair of end surfaces.   
     
     
         12 . An electronic device comprising:
 an electronic component according to  claim 1 .