Apparatus and methods for cooling of an integrated circuit

Abstract

Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant to transfer heat generated by the IC to the coolant. The system also includes a controller for periodically increasing a heat flux supplied by the IC to the coolant followed by a reduction of the heat flux supplied by the IC to the coolant. Methods for controlling the operational parameters of the IC to periodically increasing and then decreasing the heat flux supplied by the IC to the coolant are also provided. A sensor may be used to sense a state of phase change of the coolant and which generates a signal that the controller uses to adjust the heat flux supplied by the IC.

1 - 34 . (canceled) 
     
     
         35 . A system for managing heat transfer with an Integrated Circuit (IC) having at least one surface, the system comprising:
 a. A vessel for holding a coolant in a liquid phase, the at least one surface being thermally coupled to the coolant to transfer heat generated by the IC to the coolant;   b. At least one sensor for sensing a state of phase change of the coolant;   c. A controller configured for:
 i. Monitoring via the sensor the state of phase change of the coolant at the at least one surface of the IC; and 
 ii. Implementing an active cooling action to avoid formation of a dry film condition around the at least one surface of the IC. 
   
     
     
         36 . The system of  claim 35 , wherein the controller comprises software executed by a processor. 
     
     
         37 . The system of  claim 36 , wherein the IC comprises the processor. 
     
     
         38 . The system of  claim 36 , wherein the processor is external to the IC. 
     
     
         39 . The system of  claim 35 , wherein the sensor generates a signal being used by the controller to monitor the state of phase change of the dielectric coolant. 
     
     
         40 . The system of  claim 39 , wherein the sensor comprises an optical sensor. 
     
     
         41 . The system of  claim 39 , wherein the sensor comprises an acoustic sensor. 
     
     
         42 . The system of  claim 39 , wherein the sensor comprises a temperature sensor. 
     
     
         43 . The system of  claim 39 , wherein the sensor comprises a pressure sensor. 
     
     
         44 . The system of  claim 35 , wherein the cooling action includes creating a forced liquid flow of dielectric coolant across the at least one surface of the IC. 
     
     
         45 . The system of  claim 35 , wherein the cooling action includes inducing vibrations of the at least one surface of the IC. 
     
     
         46 . The system of  claim 35 , wherein the cooling action includes increasing a pressure within the vessel. 
     
     
         47 . A system for cooling an Integrated Circuit (IC) having at least one surface, the system comprising:
 a. A vessel for holding a coolant in a liquid phase, the at least one surface being thermally coupled to the coolant to transfer heat generated by the IC to the coolant;   b. The transfer of heat from the least one surface of the IC to the coolant being characterized by a heat flux;   c. A controller configured for:
 i. Determining a window of time during which the heat flux from the at least one surface of the IC to the coolant can be increased from a first heat flux to a second heat flux while avoiding formation of a dry film condition around the at least one surface of the IC; 
 ii. Adjusting at least one operational parameter of the IC to increase the heat flux from the first heat flux to the second heat flux during the window of time; 
 iii. After expiration of the window of time, adjusting the at least one operational parameter of the IC to decrease the heat flux from the second heat flux to the first heat flux. 
   
     
     
         48 . The system of  claim 47 , wherein the controller comprises software executed by a processor. 
     
     
         49 . The system of  claim 48 , wherein the IC comprises the processor. 
     
     
         50 . The system of  claim 48 , wherein the processor is external to the IC. 
     
     
         51 . The system of  claim 47 , wherein the at least one operational parameter of the IC to increase the heat flux from the first heat flux to the second heat flux is the clock frequency of the IC. 
     
     
         52 . The system of  claim 47 , further comprising at least one sensor for sensing a state of phase change of the coolant and which generates a signal, the signal being used by the controller to regulate the transfer of thermal energy between the IC and the coolant.