Polyamides based on aminoalkylpiperazine or aminoarylpiperazine for hot-melt adhesives

Abstract

Semicrystalline polyamide comprising at least one monomer resulting from the condensation of a diacid and a diamine of formula AP.Y, said semicrystalline polyamide having the following general formula (I): AP.Y/(A) m /(Pip.Y′) n /(B.Y″) q   (1) and said semicrystalline polyamide having a Tm 1 less than or equal to about 150° C., notably less than or equal to about 130° C., in particular less than or equal to about 120° C. and/or a Tg less than or equal to about 60° C., in particular less than Or equal to about 50° C., notably less than or equal to about 40° C., as determined by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013), respectively.

What is claimed is: 
     
         1 . A semicrystalline polyamide comprising at least one monomer resulting from the condensation of a diacid and a diamine of formula AP.Y, 
       in which:
 AP represents at least one asymmetric diamine monomer of the piperazine type with the following formula: 
 
       
         
           
           
               
               
           
         
          in which:
 R 1  represents H or —Z 1 —NH 2  and Z 1  represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, and 
 R 2  represents H or —Z 2 —NH 2  and Z 2  represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, 
 R 1  and R 2  being different from one another, and 
 
         Y represents at least one dicarboxylic acid excluding the dimers and/or trimers of fatty acids, 
       
       said semicrystalline polyamide having the following general formula:
   AP.Y/A/Pip.Y′
 
 
       in which:
 A represents at least one polyamide with a long-chain aliphatic unit, excluding PA6, 
 Pip denotes piperazine and Y′ represents at least one dicarboxylic acid excluding the dimers and/or trimers of fatty acids, and Y and Y′ may be identical or different, and 
 
       said semicrystalline polyamide has a Tm 1  less than or equal to about 150° C. and/or a Tg less than or equal to about 60° C., as determined by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013), respectively. 
     
     
         2 . The semicrystalline polyamide according to  claim 1 , in which AP represents aminoethylpiperazine (AEP) and Y is selected from the group consisting of adipic acid, sebacic acid, azelaic acid, dodecanedioic acid, brassylic acid, tetradecanedioic acid, hexanedioic acid and octadecanedioic acid. 
     
     
         3 . The semicrystalline polyamide according to  claim 1 , in which A is derived from the condensation of a lactam selected from the group consisting of β,β-dimethylpropiolactam, α,α-dimethylpropiolactam, amylolactam, capryllactam, oenantholactam and lauryllactam. 
     
     
         4 . The semicrystalline polyamide according to  claim 1 , in which A is derived from the condensation of an alpha-omega amino acid having from 4 to 18 carbon atoms. 
     
     
         5 . The semicrystalline polyamide according to  claim 1 , in which A is derived from the condensation of monomers of the diamine diacid type, wherein
 the diamine is selected from diamines of the piperazine type and aliphatic diamines having from 4 to 36 atoms, and   the diacid is selected from aliphatic or cycloaliphatic diacids having 4 to 18 carbon atoms.   
     
     
         6 . The semicrystalline polyamide according to  claim 5 , in which the monomers of the diamine diacid type are selected from 6.6, 6.10, 6.11, 6.12, 6.13, 6.14, 6.18, 10.10, 10.12, 10.13, 10:14 and 10.18. 
     
     
         7 . The semicrystalline polyamide according to one of  claim 1 , in which Y′ is selected from the group consisting of adipic acid, sebacic acid, azelaic acid, dodecanedioic acid, brassylic acid, tetradecanedioic acid, hexanedioic acid, and octadecanedioic acid. 
     
     
         8 . The semicrystalline polyamide according to one of  claim 8 , in which Y′ is selected from sebacic acid and tridecanedioic acid. 
     
     
         9 . The semicrystalline polyamide according to  claim 1 , said polyamide having a solubility in an alcohol-water mixture, in particular an isopropanol-water mixture (85/15: v/v) at room temperature (20° C.) of at least 15%. 
     
     
         10 . The semicrystalline polyamide according to  claim 1 , said polyamide having a Tm 1  less than or equal to about 130° C., and/or a Tg less than or equal to about 50° C. 
     
     
         11 . The semicrystalline polyamide according to  claim 1 , said polyamide having a Tm 1  less than or equal to about 100° C. and/or a Tg less than or equal to about 35° C. 
     
     
         12 . A composition comprising a polyamide as defined in  claim 1 . 
     
     
         13 . The composition according to  claim 12 , further comprising additives selected from the group consisting of antioxidants, UV stabilizers, optical brighteners and mixtures thereof. 
     
     
         14 . The composition according to  claim 12 , wherein said composition is part of a hot-melt adhesive. 
     
     
         15 . The composition according to  claim 14 , wherein said hot melt adhesive adheres parts of articles in the textile industry, and/or in the manufacture of sports articles. 
     
     
         16 . The composition of  claim 14  wherein said composition is free from plasticizer. 
     
     
         17 . The semicrystalline polyamide according to  claim 4 , wherein A is derived from the condensation of an alpha-omega amino acid having from 4 to 18 carbon atoms, said alpha-omega amino acids being selected from the group consisting of 7-aminoheptanoic, 11-aminoundecanoic, N-heptyl-11-aminoundecanoic and 12-aminododecanoic acids. 
     
     
         18 . The semicrystalline polyamide according to  claim 5 , wherein the diamine is selected from diamines of the piperazine type and aliphatic diamines having from 4 to 36 atoms, selected from the group consisting of hexamethylenediamine, tetramethylenediamine, octamethylenediamine, decamethylene-diamine, dodecamethylenediamine, 1,5-diaminohexane, 2,2,4-trimethyl-1,6-diaminohexane, diamine polyols, isophorone diamine (IPD), methyl pentamethylenediamine (MPMD), bis(aminocyclohexyl) methane (BACM), bis(3-methyl-4 aminocyclohexyl) methane (BMACM), meta-xylenediamine, and bis-p aminocyclohexylmethane. 
     
     
         19 . The semicrystalline polyamide according to  claim 10 , said polyamide having a Tm j  less than or equal to about 120° C. and/or a Tg less than or equal to about 40° C. 
     
     
         20 . The composition of  claim 14 , wherein said hot-melt adhesive is in the form of a thin sheet, a film, granules, a filament, a mat, a powder or a suspension.