Applications, methods and systems for materials processing with visible raman laser

Abstract

Laser additive manufacturing systems and apparatus using laser wavelengths below 800 nm. Raman laser modules having laser pump sources in the blue wavelength range. Matching functional laser beam wavelength with maximum absorption wavelengths of starting materials.

1 - 42 . (canceled) 
     
     
         43 . A method of laser additive manufacturing (LAM), the method comprising:
 a. providing a starting material, the starting material having a predetermined maximum absorption wavelength;   b. directing a functional laser beam having a predetermined wavelength to the starting material, the functional laser beam wavelength being based at least in part to match the starting material maximum absorption wavelength;   c. the functional laser beam interacting with the starting material to build an article.   
     
     
         44 . The method of  claim 43 , wherein the functional laser beam wavelength and the maximum absorption wavelength are matched within 100 nm of each other. 
     
     
         45 . The method of  claim 43 , wherein the functional laser beam wavelength and the maximum absorption wavelength are matched within 50 nm of each other. 
     
     
         46 . The method of  claim 43 , wherein the functional laser beam wavelength and the maximum absorption wavelength are matched within 10% of each other. 
     
     
         47 . The method of  claim 43 , wherein the functional laser beam wavelength and the maximum absorption wavelength are matched within 20% of each other. 
     
     
         48 . The method of  claim 43 , wherein the functional laser beam wavelength and the maximum absorption wavelength are matched, wherein they are the same wavelength. 
     
     
         49 . The method of  claim 43 , wherein the article is built in a single step. 
     
     
         50 . The method of  claim 45  wherein the article is built in a single step. 
     
     
         51 . The method of  claim 43 , wherein the article has: a Thermal Expansion μm/(m-K)(at 25° C.) of 7.5 to 32; Thermal Conductivity W/(m-K) of 18 to 450; Electrical Resistivity nΩ-m (at 20° C.) of 14 to 420; Young's Modulus GPa of 40 to 220; Shear Modulus GPa of 15 to 52; Bulk Modulus GPa 40 to 190; Poisson ratio of 0.2 to 0.5; Mohs hardness of 1 to 7; Vickers hardness MPa of 150 to 3500; Brinell hardness MPa 35 to 2800; Density g/cm 3  1.5 to 21. 
     
     
         52 . The method of  claim 49 , wherein the article has: a Thermal Expansion μm/(m-K)(at 25° C.) of 7.5 to 32; Thermal Conductivity W/(m-K) of 18 to 450; Electrical Resistivity nΩ-m (at 20° C.) of 14 to 420; Young's Modulus GPa of 40 to 220; Shear Modulus GPa of 15 to 52; Bulk Modulus GPa 40 to 190; Poisson ratio of 0.2 to 0.5; Mohs hardness of 1 to 7; Vickers hardness MPa of 150 to 3500; Brinell hardness MPa 35 to 2800; and Density g/cm 3  1.5 to 21. 
     
     
         53 . The method of  claim 50 , wherein the article has: a Thermal Expansion μm/(m-K)(at 25° C.) of 7.5 to 32; Thermal Conductivity W/(m-K) of 18 to 450; Electrical Resistivity nΩ-m (at 20° C.) of 14 to 420; Young's Modulus GPa of 40 to 220; Shear Modulus GPa of 15 to 52; Bulk Modulus GPa 40 to 190; Poisson ratio of 0.2 to 0.5; Mohs hardness of 1 to 7; Vickers hardness MPa of 150 to 3500; Brinell hardness MPa 35 to 2800; and Density g/cm 3  1.5 to 21. 
     
     
         54 . The method of  claim 43 , wherein the article has: a Thermal Expansion μm/(m-K)(at 25° C.) of 7.5 to 32; Thermal Conductivity W/(m-K) of 18 to 450; Young's Modulus GPa of 40 to 220; Shear Modulus GPa of 15 to 52; Bulk Modulus GPa 40 to 190; Poisson ratio of 0.2 to 0.5; and Density g/cm 3  1.5 to 21. 
     
     
         55 . The method of  claim 43 , wherein the article has: Electrical Resistivity nΩ-m (at 20° C.) of 14 to 420; Poisson ratio of 0.2 to 0.5; and Mohs hardness of 1 to 7. 
     
     
         56 . The method of  claim 43 , wherein the article has: a Thermal Expansion μm/(m-K)(at 25° C.) of 7.5 to 32; Electrical Resistivity nΩ-m (at 20° C.) of 14 to 420; Young's Modulus GPa of 40 to 220; Mohs hardness of 1 to 7; and Density g/cm 3  1.5 to 21. 
     
     
         57 . The method of  claim 43 , wherein the article has a physical property selected from the group consisting of: a Thermal Expansion μm/(m-K)(at 25° C.) of 7.5 to 32; Thermal Conductivity W/(m-K) of 18 to 450; Electrical Resistivity nΩ-m (at 20° C.) of 14 to 420; Young's Modulus GPa of 40 to 220; Shear Modulus GPa of 15 to 52; Bulk Modulus GPa 40 to 190; Poisson ratio of 0.2 to 0.5; Mohs hardness of 1 to 7; Vickers hardness MPa of 150 to 3500; Brinell hardness MPa 35 to 2800; and Density g/cm 3  1.5 to 21. 
     
     
         58 - 61 . (canceled)