Display device using semiconductor light emitting device and method for manufacturing the same

Abstract

Discussed in a method of fabricating a display device, the method including transferring a substrate to an assembly position, and placing a plurality of semiconductor light emitting devices each having a first conductive semiconductor layer and a second conductive semiconductor layer into a fluid chamber, guiding a movement of the plurality of semiconductor light emitting devices in the fluid chamber to assemble the plurality of semiconductor light emitting devices at preset positions of the substrate, etching at least one of the first conductive semiconductor layer and the second conductive semiconductor layer while the plurality of semiconductor light emitting devices are placed at the preset positions of the substrate and connecting a first wiring electrode and a second wiring electrode respectively to each of the plurality of semiconductor light emitting devices.

What is claimed is: 
     
         1 . A method of fabricating a display device, the method comprising:
 transferring a substrate to an assembly position, and placing a plurality of semiconductor light emitting devices each having a first conductive semiconductor layer and a second conductive semiconductor layer into a fluid chamber;   guiding a movement of the plurality of semiconductor light emitting devices in the fluid chamber to assemble the plurality of semiconductor light emitting devices at preset positions of the substrate;   etching at least one of the first conductive semiconductor layer and the second conductive semiconductor layer while the plurality of semiconductor light emitting devices are placed at the preset positions of the substrate; and   connecting a first wiring electrode and a second wiring electrode respectively to each of the plurality of semiconductor light emitting devices.   
     
     
         2 . The method of  claim 1 , wherein the plurality of semiconductor light emitting devices are each provided with a magnetic body, and guided to the preset positions of the substrate by an electric field and a magnetic field. 
     
     
         3 . The method of  claim 2 , wherein the assembly process comprises:
 applying the magnetic field to the plurality of semiconductor light emitting devices to move the plurality of semiconductor light emitting devices along a direction in the fluid chamber; and   guiding the plurality of semiconductor light emitting devices to the preset positions of the substrate by applying the electric field so as to allow the plurality of semiconductor light emitting devices to be placed at the preset positions during the movement of the plurality of semiconductor light emitting devices.   
     
     
         4 . The method of  claim 2 , further comprising removing the magnetic body from each of the plurality of semiconductor light emitting devices. 
     
     
         5 . The method of  claim 4 , wherein the magnetic body performs as an etch resist for one of the first conductive semiconductor layer or the second conductive semiconductor layer. 
     
     
         6 . The method of  claim 1 , further comprising:
 forming a passivation layer on the substrate and the plurality of semiconductor light emitting devices so that a height of the passivation layer is greater than a height of the plurality of semiconductor light emitting devices, and   forming at least one contact hole in the passivation layer for each of the plurality of semiconductor light emitting devices.   
     
     
         7 . The method of  claim 1 , wherein the substrate includes a plurality of pair electrodes, the plurality of pair electrodes including a first pair electrode and a second pair electrode,
 wherein the first pair electrode and the second pair electrode are spaced apart from each other with a gap, and   wherein the plurality of semiconductor light emitting devices are disposed over the gap.   
     
     
         8 . A method of fabricating a display device, the method comprising:
 forming a plurality of semiconductor light emitting devices each having a magnetic body, a first conductive semiconductor layer, and a second conductive semiconductor layer;   transferring a substrate to an assembly position, and placing the plurality of semiconductor light emitting devices into a fluid chamber;   guiding a movement of the plurality of semiconductor light emitting devices in the fluid chamber using a magnetic force, and assembling the plurality of semiconductor light emitting devices at preset positions of the substrate using an electric field;   removing the magnetic body from the plurality of semiconductor light emitting devices placed at the preset positions of the substrate;   etching at least one of the first conductive semiconductor layer and the second conductive semiconductor layer; and   connecting a first wiring electrode and a second wiring electrode respectively to each of the plurality of plurality of semiconductor light emitting devices.   
     
     
         9 . The method of  claim 8 , wherein the magnetic body is protruded from one of the first conductive semiconductor layer or the second conductive semiconductor layer to be etched between the first conductive semiconductor layer and the second conductive semiconductor layer. 
     
     
         10 . The method of  claim 8 , wherein the magnetic body performs as an etch resist for one of the first conductive semiconductor layer or the second conductive semiconductor layer.