Camera module

Abstract

A camera module is provided, including a lens holder, a driving mechanism, a frame, a base, a sensing element, and a plurality of three-dimensional circuits. The lens holder carries a lens with an optical axis. The driving mechanism is configured to drive the lens holder along the optical axis. The frame receives the driving mechanism and the lens holder therein. The base supports the frame, and a recess is formed on the bottom of the base. Specifically, the recess is formed by the outer periphery of the bottom of the base extending toward the light-exit direction of the optical axis. The sensing element is disposed in the recess. The three-dimensional circuits are formed in the recess and electrically connected to the sensing element and the driving mechanism.

What is claimed is: 
     
         1 . An integrated substrate for an optical module, comprising:
 a substrate;   an optical sensing element, disposed on a first surface of the substrate;   an electronic element, disposed on a second surface of the substrate; and   a circuit element, the optical sensing element electrically connected to the electronic element via the circuit element, wherein the first surface is not parallel to the second surface.   
     
     
         2 . The integrated substrate as claimed in  claim 1 , wherein positions of the electronic element and the optical sensing element overlap when viewed along an optical axis. 
     
     
         3 . The integrated substrate as claimed in  claim 1 , wherein the electronic element is welded to the circuit element. 
     
     
         4 . The integrated substrate as claimed in  claim 1 , wherein the substrate comprises a recess formed on a bottom of the substrate, the recess is formed by an outer periphery of the bottom of the substrate extending toward a light-exit direction of an optical axis, and the recess is passed through by the optical axis. 
     
     
         5 . The integrated substrate as claimed in  claim 4 , wherein the optical sensing element is disposed in the recess. 
     
     
         6 . The integrated substrate as claimed in  claim 4 , wherein the circuit element is formed in the recess. 
     
     
         7 . The integrated substrate as claimed in  claim 4 , wherein the circuit element is formed in the recess by an insert molding technique or a molded interconnect device technique. 
     
     
         8 . The integrated substrate as claimed in  claim 4 , wherein the recess is formed between the bottom of the substrate and the outer periphery extending therefrom. 
     
     
         9 . The integrated substrate as claimed in  claim 4 , wherein the recess has a top surface and a plurality of side surfaces parallel to the optical axis, and the circuit element is formed on at least one of the top surface and the side surfaces. 
     
     
         10 . The integrated substrate as claimed in  claim 9 , wherein the electronic element is disposed on at least one of the top surface and the side surfaces of the recess. 
     
     
         11 . An optical module using the integrated substrate as claimed in  claim 1 , comprising:
 a movable part, configure to connect an optical element;   a fixed part, the movable part being movable relative to the fixed part; and   a driving assembly, driving the movable part to move relative to the fixed part, wherein the driving assembly is electrically connected to the integrated substrate.   
     
     
         12 . The optical module as claimed in  claim 11 , wherein the circuit element is electrically connected to the driving assembly. 
     
     
         13 . The optical module as claimed in  claim 11 , wherein the driving assembly comprises a driving coil and a plurality of driving magnets, the driving coil is disposed on the movable part, and the driving magnets is fixed on the fixed part and adjacent to the driving coil. 
     
     
         14 . The optical module as claimed in  claim 11 , wherein the substrate comprises a recess formed on a bottom of the substrate, the recess is formed by an outer periphery of the bottom of the substrate extending toward a light-exit direction of an optical axis, and the recess is passed through by the optical axis. 
     
     
         15 . The optical module as claimed in  claim 14 , wherein the circuit element passes through the substrate to electrically connect to the driving assembly. 
     
     
         16 . The optical module as claimed in  claim 14 , wherein positions of the electronic element and the optical sensing element overlap when viewed along the optical axis. 
     
     
         17 . The optical module as claimed in  claim 14 , wherein the recess is formed between the bottom of the substrate and the outer periphery extending therefrom. 
     
     
         18 . The optical module as claimed in  claim 14 , wherein the circuit element is formed in the recess by an insert molding technique or a molded interconnect device technique. 
     
     
         19 . The optical module as claimed in  claim 14 , wherein the recess has a top surface and a plurality of side surfaces parallel to the optical axis, and the circuit element is formed on at least one of the top surface and the side surfaces. 
     
     
         20 . The optical module as claimed in  claim 19 , wherein the electronic element is disposed on at least one of the top surface and the side surfaces of the recess.