Method of manufacturing sensing chip and sensing chip

Abstract

A first frame having a first through-hole is arranged on a support so that one opening of the first through-hole is closed. A liquid containing a capturer for capturing a substance to be detected is fed into the first through-hole, and the capturer is immobilized on the support exposed in the first through-hole. After removing the liquid from the support, a second frame having the second through-hole is arranged on the support in the first through-hole so that one opening of the second through-hole is closed.

1 . A method of manufacturing a sensing chip for detecting a substance to be detected in a specimen, the method comprising:
 arranging a first frame having a first through-hole on a support so that one opening of the first through-hole is closed;   feeding a liquid containing a capturer for capturing the substance to be detected in the first through-hole and immobilizing the capturer on the support exposed in the first through-hole; and   removing the liquid from the support, and thereafter arranging a second frame having a second through-hole on the support in the first through-hole so that one opening of the second through-hole is closed.   
     
     
         2 . The method of manufacturing a sensing chip according to  claim 1 , wherein the first frame has a light blocking property. 
     
     
         3 . The method of manufacturing a sensing chip according to  claim 1 , wherein the first frame has a tapered portion where, as the first frame is away from the support, a cross-sectional area of the first through-hole increases in a direction perpendicular to a height direction of the first through-hole. 
     
     
         4 . The method of manufacturing a sensing chip according to  claim 1 , wherein the second frame has a tapered portion where, as the second frame is away from the support, a cross-sectional area of the second through-hole increases in a direction perpendicular to a height direction of the second through-hole. 
     
     
         5 . The method of manufacturing a sensing chip according to  claim 1 , wherein a height of the second through-hole is larger than a height of the first through-hole. 
     
     
         6 . The method of manufacturing a sensing chip according to  claim 4 , wherein an inner wall surface of the tapered portion of the second frame is inclined so that light emitted from a center of a surface of the support exposed in the second through-hole and emitted at an emitting angle of 20° or less is not blocked. 
     
     
         7 . The method of manufacturing a sensing chip according to  claim 1 , further comprising performing a blocking treatment on an inner wall surface of the second through-hole. 
     
     
         8 . The method of manufacturing a sensing chip according to  claim 1 , wherein at least one of the support, the first frame, and the second frame has a reagent holder for accommodating a reagent. 
     
     
         9 . The method of manufacturing a sensing chip according to  claim 1 , wherein at least one of the first frame and the second frame is made of a resin film. 
     
     
         10 . The method of manufacturing a sensing chip according to  claim 1 , wherein the support is a prism made of a dielectric material and having a metal film formed on one surface thereof, and the first frame and the second frame are arranged on the one surface.