Method for producing an optoelectronic device, and an optoelectronic device produced by the method

Abstract

In various aspects, an optoelectronic device is provided. The device may include a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material, a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and at least one optoelectronic component, arranged between the first substrate and the second substrate, wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.

What is claimed is: 
     
         1 . An optoelectronic device, comprising:
 a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material,   a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and   at least one optoelectronic component, arranged between the first substrate and the second substrate,   wherein the first substrate is arranged in a coplanar or substantially coplanar manner with respect to the second substrate.   
     
     
         2 . The optoelectronic device according to  claim 1 , wherein the second non-planar shape is identical or substantially identical to the first non-planar shape. 
     
     
         3 . The optoelectronic device according to  claim 1 , wherein the first non-planar shape and the second non-planar shape each comprise at least one curvature or at least one bend. 
     
     
         4 . The optoelectronic device according to  claim 1 , wherein the first shape memory material and/or the second shape memory material comprises a metallic alloy or at least one polymer. 
     
     
         5 . The optoelectronic device according to  claim 1 , wherein the at least one optoelectronic component is laminated to the first substrate and/or the second substrate. 
     
     
         6 . The optoelectronic device according to  claim 1 , wherein the optoelectronic device is a display or a luminous module. 
     
     
         7 . The optoelectronic device according to  claim 1 , wherein the at least one optoelectronic component comprises an electromagnetic radiation emitting component. 
     
     
         8 . The optoelectronic device according to  claim 1 , wherein the at least one optoelectronic component comprises an organic light emitting diode. 
     
     
         9 . The optoelectronic device according to  claim 1  comprising a plurality of light emitting components which are accommodated in a common housing. 
     
     
         10 . The optoelectronic device according to  claim 1 , wherein the at least one optoelectronic component comprises a first electrode on the first substrate, an organic functional layer stack on the first electrode, and a second electrode on the organic functional layer stack. 
     
     
         11 . The optoelectronic device according to  claim 1 , wherein the optoelectronic device is flexible. 
     
     
         12 . A method for producing an optoelectronic device, the method comprising:
 providing a first substrate and a second substrate, wherein the first substrate and the second substrate are formed in each case in a non-planar shape or are brought to the non-planar shape,   reshaping the first substrate and the second substrate in each case to a planar or substantially planar shape,   forming at least one optoelectronic component on the first substrate having the planar shape or having the substantially planar shape or on the second substrate having the planar shape or having the substantially planar shape, wherein the at least one optoelectronic component is formed between the first substrate and the second substrate, and   reshaping the first substrate having the planar shape or having the substantially planar shape and the second substrate having the planar shape or having the substantially planar shape in each case to a final non-planar shape.   
     
     
         13 . The method according to  claim 12 , wherein the reshaping of the first substrate and/or of the second substrate comprises mechanical reshaping. 
     
     
         14 . The method according to  claim 13 , wherein the reshaping comprises a fixing by a releasable, mechanical connection. 
     
     
         15 . The method of  claim 13 , wherein the reshaping comprises a fixing by a releasable, mechanical clamping. 
     
     
         16 . An optoelectronic device, comprising:
 a first substrate having a first non-planar shape, wherein the first substrate comprises a first shape memory material,   a second substrate having a second non-planar shape, wherein the second substrate comprises a second shape memory material, and   at least one optoelectronic component arranged between the first substrate and the second substrate,   wherein the first non-planar shape and the second non-planar shape have a similar curvature with respect to one another.   
     
     
         17 . The optoelectronic device of  claim 16 , wherein the at least one optoelectronic component is laminated to the first substrate and/or the second substrate. 
     
     
         18 . The optoelectronic device of  claim 16 , wherein the first non-planar shape and the second non-planar shape each comprise at least one bend. 
     
     
         19 . The optoelectronic device of  claim 18 , wherein a shape of the at least one optoelectronic component is provided by the similar curvatures of the first substrate and the second substrate. 
     
     
         20 . The optoelectronic device of  claim 19 , wherein the at least one optoelectronic component is formed in a neutral axis region of the optoelectronic device so that the at least one optoelectronic component is subject to reduced compression and/or extension.