Method for laser processing a transparent material

Abstract

Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding up to 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.

What is claimed is: 
     
         1 . A method of laser processing a material, comprising the steps of:
 providing a laser beam having bursts of laser pulses, the laser pulses having a pulse width of less than 100 picoseconds, the material being transparent to the laser beam;   focusing the laser beam using one or more optical components having spherical aberration, the optical components inducing aberration and focusing the laser beam in a distributed manner along a longitudinal axis of the laser beam, the focused laser beam having sufficient energy density in the material to self-focus and form a laser filament therein, laser energy deposited along the laser filament creating a modification in the material, the distributed focus maintaining sufficient intensity to accomplish material modification over a desired length therein, the material modification having a shape defined by the laser filament; and   translating the focused laser beam laterally to form an array of closely positioned filament-induced modifications in the material.   
     
     
         2 . The method of  claim 1 , wherein the laser filament extends over a portion of the thickness of the material. 
     
     
         3 . The method of  claim 1 , wherein the laser filament extends over the full thickness of the material. 
     
     
         4 . The method of  claim 1 , wherein the modified material is radially compressed over the entire length of the laser filament. 
     
     
         5 . The method of  claim 1 , wherein the material modification is a void. 
     
     
         6 . The method of  claim 5 , wherein the void extends through the entire thickness of the material. 
     
     
         7 . The method of  claim 1 , wherein the material modification is one of defects, color centers, stress, micro-channels, micro-voids, and micro-cracks. 
     
     
         8 . The method of  claim 1 , wherein the material modification is formed without laser ablation damage at the top and bottom surfaces of the material. 
     
     
         9 . The method of  claim 1 , wherein the ultrafast laser pulses have a pulse width of less than 25 picoseconds. 
     
     
         10 . The method of  claim 1 , wherein the laser pulses within each burst have a relative delay that is less than a timescale for relaxation of all material-modification dynamics. 
     
     
         11 . The method of  claim 1 , wherein the focused laser beam has a waist located below the material. 
     
     
         12 . The method of  claim 1 , wherein the focused laser beam has a waist located above the material. 
     
     
         13 . The method of  claim 1 , wherein after the translating step, the material is cleaved along the array of filament-induced modifications. 
     
     
         14 . The method of  claim 13 , wherein the cleaving step separates the material by one of additional laser processing, heating, cooling, and mechanical pressure. 
     
     
         15 . The method of  claim 13 , wherein the edge roughness of the cleaved material is controlled by selecting the degree-of-overlap or discrete-spacing of the filament-induced modifications. 
     
     
         16 . The method of  claim 13 , wherein the root-mean-square roughness of the cleaved surfaces is less than 10 micrometers. 
     
     
         17 . The method of  claim 1 , wherein the laser filament has a length of greater than 1 millimeter. 
     
     
         18 . The method of  claim 1 , wherein the focused laser beam has a uniform energy distribution along the longitudinal axis of the laser beam. 
     
     
         19 . The method of  claim 1 , wherein the laser processing is accomplished in a single pass during the translating step. 
     
     
         20 . The method of  claim 1 , wherein the material is scribed and separated during the translating step.