US2020330231A1PendingUtilityA1

Methods of forming implants with porous surfaces using heat bonding

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Assignee: SMED TA TD LLCPriority: Apr 18, 2019Filed: Apr 16, 2020Published: Oct 22, 2020
Est. expiryApr 18, 2039(~12.8 yrs left)· nominal 20-yr term from priority
B29C 65/006B29C 65/02A61F 2/38A61F 2310/00029A61F 2002/30967A61F 2/389A61F 2/30767A61F 2002/30784A61F 2310/00017A61F 2/3094A61F 2002/30968A61F 2/30771A61F 2/3859A61F 2002/3093A61F 2310/00023A61F 2002/3895A61F 2/4081A61F 2/28A61F 2002/3092
62
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Claims

Abstract

A method of forming an orthopaedic implant includes: heat bonding a porous material to a surface of an insert to form a bonded insert; placing a bare portion of the bonded insert in an opening formed in a material of an implant body; and heat bonding the bare portion to the material to bond the bonded insert to the implant body.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of forming an orthopaedic implant, comprising:
 heat bonding a porous material to a surface of an insert to form a bonded insert;   placing a bare portion of the bonded insert in an opening formed in a material of an implant body; and   heat bonding the bare portion to the material to bond the bonded insert to the implant body.   
     
     
         2 . The method of  claim 1 , wherein heat bonding the bare portion comprises diffusion bonding of the bare portion to the material. 
     
     
         3 . The method of  claim 1 , wherein heat bonding the bare portion comprises sintering of the bare portion to the material. 
     
     
         4 . The method of  claim 1 , wherein the bare portion comprises a flange defining a flange width that is greater than or equal to an opening width of the opening. 
     
     
         5 . The method of  claim 1 , wherein the bare portion comprises a flange defining a flange width that is less than an opening width of the opening. 
     
     
         6 . The method of  claim 1 , wherein the opening is defined by a plurality of walls extending from a bottom surface. 
     
     
         7 . The method of  claim 5 , wherein the walls perpendicularly extend from the bottom surface. 
     
     
         8 . The method of  claim 1 , wherein the porous material of the bonded insert covers the opening when the bare portion is placed in the opening. 
     
     
         9 . The method of  claim 1 , further comprising forming an opening pattern in the implant body, the opening pattern including the opening. 
     
     
         10 . An orthopaedic implant, comprising:
 an implant body comprising a surface having an opening formed therein;   a bonded insert comprising a bare portion disposed within the opening and a bonded portion coupled to the bare portion, the bare portion being heat bonded to the implant body; and   a porous ingrowth material coupled to the bonded portion.   
     
     
         11 . The orthopaedic implant of  claim 10 , wherein the porous ingrowth material covers the opening. 
     
     
         12 . The orthopaedic implant of  claim 10 , wherein the bare portion comprises at least one flange, the opening defining an opening width and the flange defining a flange width that is greater than or equal to the opening width. 
     
     
         13 . The orthopaedic implant of  claim 10 , wherein the bare portion comprises a flange defining a flange width that is less than an opening width of the opening. 
     
     
         14 . The orthopaedic implant of  claim 10 , wherein the opening is defined by a plurality of walls extending from a bottom surface. 
     
     
         15 . The orthopaedic implant of  claim 14 , wherein the walls perpendicularly extend from the bottom surface. 
     
     
         16 . The orthopaedic implant of  claim 10 , wherein the porous ingrowth material covers the opening. 
     
     
         17 . The orthopaedic implant of  claim 10 , wherein the implant body comprises a plurality of openings, the orthopaedic implant comprising a plurality of bonded inserts each having a respective bare portion disposed in a respective one of the openings. 
     
     
         18 . A method of forming an orthopaedic implant, comprising:
 placing a complex component in contact with at least one bonding surface of an implant body, the complex component having a shape that includes at least one complex outer surface; and   heat bonding the complex component to the at least one bonding surface to form the orthopaedic implant.   
     
     
         19 . The method of  claim 18 , wherein the at least one complex outer surface is at least one of a tapered surface or a curved surface. 
     
     
         20 . The method of  claim 18 , wherein the complex component comprises at least one of a solid material or a porous ingrowth material.

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