Methods to incorporate silver nanowire-based transparent conductors in electronic devices

Abstract

Disclosed herein are optical stacks that are stable to light exposure by incorporating light-stabilizers.

1 . An optical stack comprising:
 a first substrate;   a conductor layer disposed over the first substrate, wherein the conductor layer comprises a conductive network of nanostructures and a polymer in which the nanostructures are disposed; and   an optically clear adhesive (OCA) layer abutting the conductor layer, wherein:
 an interface is defined where the OCA layer abuts the conductor layer, 
 the polymer is only present at least one of at or below the interface, and 
 the OCA layer comprises one or more photo-stabilizers. 
   
     
     
         2 . The optical stack of  claim 1 , wherein a total weight of the one or more photo-stabilizers in the OCA layer is at least 10% of a total weight of the OCA layer. 
     
     
         3 . The optical stack of  claim 1 , wherein the nanostructures are entirely disposed below the interface. 
     
     
         4 . The optical stack of  claim 1 , wherein the nanostructures comprise silver nanostructures. 
     
     
         5 . The optical stack of  claim 1 , wherein the OCA layer comprises one or more photo-sensitive species. 
     
     
         6 . The optical stack of  claim 5 , wherein the one or more photo-stabilizers suppress an oxidation of the nanostructures induced by the one or more photo-sensitive species. 
     
     
         7 . The optical stack of  claim 1 , wherein the one or more photo-stabilizers comprise at least one of an alkene, a hindered phenol, a tetrazole, a triazole, a phosphine, a thioether, or a metallic photo-desensitizer. 
     
     
         8 . The optical stack of  claim 1 , wherein the OCA layer is between the first substrate and the conductor layer. 
     
     
         9 . The optical stack of  claim 1 , wherein the conductor layer is between the first substrate and the OCA layer. 
     
     
         10 . The optical stack of  claim 1 , comprising:
 a second substrate, wherein:
 the conductor layer is between the first substrate and the OCA layer, and 
 the OCA layer is between the conductor layer and the second substrate. 
   
     
     
         11 . The optical stack of  claim 10 , wherein:
 the conductor layer abuts the first substrate, and   the OCA layer abuts the second substrate.   
     
     
         12 . An optical stack, comprising:
 a first substrate;   a conductor layer disposed over the first substrate, wherein the conductor layer comprises a conductive network of nanostructures and a binder in which the nanostructures are disposed, wherein the binder has a first composition; and   an optically clear adhesive (OCA) layer disposed over the conductor layer, wherein:
 the OCA layer has an uppermost surface and a bottommost surface, 
 an interface is defined where the bottommost surface of the OCA layer abuts the conductor layer, 
 the OCA layer has a homogenous composition extending from the uppermost surface of the OCA layer to the bottommost surface of the OCA layer and different than the first composition, and 
 the OCA layer comprises one or more photo-stabilizers. 
   
     
     
         13 . The optical stack of  claim 12 , wherein the nanostructures are entirely disposed below the interface. 
     
     
         14 . The optical stack of  claim 12 , wherein the OCA layer comprises one or more photo-sensitive species. 
     
     
         15 . The optical stack of  claim 14 , wherein the one or more photo-stabilizers suppress an oxidation of the nanostructures induced by the photo-sensitive species. 
     
     
         16 . A method of forming an optical stack, comprising:
 forming an optically clear adhesive (OCA) layer on a substrate;   exposing the OCA layer to a liquid comprising one or more photo-stabilizers, wherein at least some of the one or more photo-stabilizers infiltrate into the OCA layer during the exposing;   removing excess liquid on the OCA layer after the exposing; and   forming a conductor layer on the OCA layer after the removing, wherein the conductor layer comprises a conductive network of nanostructures and a binder in which the nanostructures are disposed.   
     
     
         17 . The method of  claim 16 , wherein the removing comprises:
 spinning the OCA layer and the substrate; and   baking the OCA layer and the substrate.   
     
     
         18 . The method of  claim 16 , wherein the removing comprises:
 spinning the OCA layer and the substrate; and   exposing the OCA layer and the substrate to a nitrogen atmosphere.   
     
     
         19 . The method of  claim 16 , wherein the one or more photo-stabilizers comprise at least one of terpineol, limonene, or cyclohexanol. 
     
     
         20 . The method of  claim 16 , wherein the exposing comprises spraying the liquid comprising the one or more photo-stabilizers onto the OCA layer.