US2020359633A1PendingUtilityA1
Antimicrobial/antiviral composition
Est. expirySep 4, 2037(~11.1 yrs left)· nominal 20-yr term from priority
A01N 59/20C09D 5/14C09D 201/00C09D 7/62A01N 25/26A01N 25/04A01N 25/10
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Claims
Abstract
The antimicrobial/antiviral composition includes: a resin; an antimicrobial/antiviral agent containing monovalent copper compound microparticles coated with a dispersant; and a hydrophilic compound that is dispersed in the resin and is immiscible with the resin.
Claims
exact text as granted — not AI-modified1 . An antimicrobial/antiviral composition comprising:
a resin; an antimicrobial/antiviral agent comprising monovalent copper compound microparticles coated with a dispersant; and a hydrophilic compound that is dispersed in the resin and is immiscible with the resin.
2 . The antimicrobial/antiviral composition according to claim 1 , wherein the dispersant is an inorganic compound.
3 . The antimicrobial/antiviral composition according to claim 1 , wherein the copper compound microparticles comprise at least one of cuprous oxide or copper iodide.
4 . An antimicrobial/antiviral coating comprising
the antimicrobial/antiviral composition according to claim 1 , wherein a contribution of polar component to surface free energy of coating film formed by drying and/or curing is 2.0% or higher and 40.0% or lower.
5 . An antimicrobial/antiviral resin member comprising
the antimicrobial/antiviral composition according to claim 1 , wherein a contribution of polar component to surface free energy of the antimicrobial/antiviral resin member is 2.0% or higher and 40.0% or lower.
6 . The antimicrobial/antiviral resin member according to claim 5 , wherein the antimicrobial/antiviral resin member is a molding.
7 . The antimicrobial/antiviral resin member according to claim 5 , wherein the antimicrobial/antiviral resin member is fiber.
8 . A method of producing the antimicrobial/antiviral composition according to claim 1 , comprising steps of:
mixing the resin and the hydrophilic compound to give a mixture; and mixing the mixture and the copper compound microparticles.
9 . A method of producing the antimicrobial/antiviral resin member according to claim 6 , comprising steps of:
mixing the resin, the dispersant, and the copper compound microparticles to give a first mixture; mixing the resin and the hydrophilic compound to give a second mixture; and mixing the first mixture and the second mixture.
10 . The antimicrobial/antiviral composition according to claim 2 , wherein the copper compound microparticles comprise at least one of cuprous oxide or copper iodide.
11 . An antimicrobial/antiviral coating comprising
the antimicrobial/antiviral composition according to claim 2 , wherein a contribution of polar component to surface free energy of coating film formed by drying and/or curing is 2.0% or higher and 40.0% or lower.
12 . An antimicrobial/antiviral coating comprising
the antimicrobial/antiviral composition according to claim 3 , wherein a contribution of polar component to surface free energy of coating film formed by drying and/or curing is 2.0% or higher and 40.0% or lower.
13 . An antimicrobial/antiviral resin member comprising
the antimicrobial/antiviral composition according to claim 2 , wherein a contribution of polar component to surface free energy of the antimicrobial/antiviral resin member is 2.0% or higher and 40.0% or lower.
14 . An antimicrobial/antiviral resin member comprising
the antimicrobial/antiviral composition according to claim 3 , wherein a contribution of polar component to surface free energy of the antimicrobial/antiviral resin member is 2.0% or higher and 40.0% or lower.
15 . A method of producing the antimicrobial/antiviral composition according to claim 2 , comprising steps of:
mixing the resin and the hydrophilic compound to give a mixture; and mixing the mixture and the copper compound microparticles.
16 . A method of producing the antimicrobial/antiviral composition according to claim 3 , comprising steps of:
mixing the resin and the hydrophilic compound to give a mixture; and mixing the mixture and the copper compound microparticles.Cited by (0)
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