Wireless charging module and manufacturing method thereof
Abstract
The present disclosure disclosed a wireless charging module and manufacturing method thereof. The wireless charging module includes a magnetic shield part, a coil and a first heat dissipating layer. The coil is disposed on the magnetic shield part, and the first heat dissipating layer is disposed on the surface of the coil away from the magnetic shield part. By completely cover the coil with the first heat dissipating layer in the present disclosure, the first heat dissipating layer possesses excellent heat radiation, effectively improving the heat dissipation of the coil. The thickness of the first heat dissipating layer is controllable. Therefore, an effective and highly stable heat dissipating performance can be provided without increasing the thickness and cost of the wireless charging module.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A wireless charging module, comprising:
a magnetic shield part; a coil disposed on the magnetic shield part; and a first heat dissipating layer disposed on the surface of the coil away from the magnetic shield part.
2 . The wireless charging module according to claim 1 , wherein the coil is bonded to the magnetic shield part by a first adhesive member.
3 . The wireless charging module according to claim 2 , wherein the first adhesive member is a double-sided tape, a thermal conductive film or a thermal paste.
4 . The wireless charging module according to claim 1 further comprising a second heat dissipating layer disposed on the surface of the magnetic shield part away from the coil.
5 . The wireless charging module according to claim 4 , wherein the second heat dissipating layer is bonded to the magnetic shield part by a second adhesive member.
6 . The wireless charging module according to claim 5 , wherein the second adhesive member is a double-sided tape, a thermal conductive film or a thermal paste.
7 . The wireless charging module according to claim 4 , wherein the thickness of the first heat dissipating layer and the second heat dissipating layer is 5-20 um.
8 . The wireless charging module according to claim 4 , wherein the thermal conductivity coefficient of the first heat dissipating layer and the second heat dissipating layer is between 0.5-2000 W/m·K.
9 . The wireless charging module according to claim 4 , wherein the radiation coefficient of the first heat dissipating layer and the second heat dissipating layer is between 0.90 and 0.95.
10 . A manufacturing method for a wireless charging module of claim 1 , comprising:
forming the first heat dissipating layer on the surface of the coil; and securing the magnetic shield part to the surface of the coil away from the first heat dissipating layer.
11 . The manufacturing method according to claim 10 , wherein the step of forming the first heat dissipating layer on the surface of the coil comprises forming the first heat dissipating layer on the surface of the coil by spraying, coating, or physical vapor deposition.
12 . The manufacturing method according to claim 10 , wherein the step of forming the first heat dissipating layer on the surface of the coil comprises forming the first heat dissipating layer on the surface of the coil by evaporation or sputtering.
13 . The manufacturing method according to claim 10 , wherein the step of securing magnetic shield part to the surface of the coil away from the first heat dissipating layer comprises:
forming a first adhesive member on the surface of the coil away from the first heat dissipating layer; and attaching the magnetic shield part to the first adhesive member.
14 . The manufacturing method according to claim 13 , wherein after the step of securing the magnetic shield part to the surface of the coil away from the first heat dissipating layer, further comprising:
forming a second heat dissipating layer on the surface of the magnetic shield part away from the coil.
15 . The manufacturing method according to claim 14 , wherein the step of forming the second heat dissipating layer on the surface of the magnetic shield part away from the coil comprises disposing the second heat dissipating layer on the surface of the magnetic shield part away from the coil by a second adhesive member.
16 . The manufacturing method according to claim 14 , wherein the step of forming the second heat dissipating layer on the surface of magnetic shield part away from the coil comprises forming the second heat dissipating layer on the surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition.
17 . The manufacturing method according to claim 14 , wherein the step of forming the second heat dissipating layer on the surface of magnetic shield part away from the coil comprises forming the second heat dissipating layer on the surface of the magnetic shield part away from the coil by evaporation or sputtering.Join the waitlist — get patent alerts
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