Electrolytic Preparation Of A Metal Substrate For Subsequent Electrodeposition

Abstract

A method of plating a workpiece, the method includes electrochemically removing any oxide on the surface of the workpiece by applying a first waveform to the workpiece and a cathode both placed in a first electrolyte solution, and electroplating the workpiece surface by applying a second waveform to the workpiece and an anode both placed in a second electrolyte solution including a plating material.

What is claimed is: 
     
         1 . A method of plating a workpiece, the method comprising:
 electrochemically removing any oxide on the surface of the workpiece by applying a first waveform to the workpiece and a cathode both placed in a first electrolyte solution; and   electroplating the workpiece surface by applying a second waveform to the workpiece and an anode both placed in a second electrolyte solution including a plating material.   
     
     
         2 . The method of  claim 1  further including cleaning the workpiece surface prior to electrochemically removing any oxide on the workpiece surface. 
     
     
         3 . The method of  claim 1  further including rinsing the workpiece between electrochemically removing any oxide on the workpiece surface and electroplating the workpiece surface. 
     
     
         4 . The method of  claim 1  further including rinsing the workpiece surface after electroplating. 
     
     
         5 . The method of  claim 1  in which the first waveform is a pulsed reverse waveform. 
     
     
         6 . The method of  claim 1  in which the workpiece is aluminum, titanium, silicon, or other oxide forming conductive materials/alloys. 
     
     
         7 . The method  claim 1  in which the plating material is a zinc-nickel alloy, nickel, nickel phosphorus, or other platable elements/alloys. 
     
     
         8 . The method of  claim 1  in which the first electrolyte solution includes sodium chloride, sodium bromide, sulfuric acid, sodium sulfate, potassium hydroxide, and/or other water-soluble salts. 
     
     
         9 . The method of  claim 1  in which the second electrolyte solution includes hydrochloric acid, water, and/or boric acid or other constituents required to electrodeposit a given material. 
     
     
         10 . A system for plating a workpiece, the system comprising:
 an electrochemical tank including an electrolyte solution about the workpiece and a cathode;   a first power supply for applying a first waveform to the workpiece and the cathode to electrochemically remove any oxide on the surface of the workpiece;   an electrochemical plating tank including an electrolyte solution including a plating material about the workpiece and an anode; and   a second power supply for applying a second waveform to the workpiece and the anode to electroplate the workpiece with the plating material.   
     
     
         11 . The system of  claim 10  further including a cleaning station for the workpiece for cleaning the workpiece surface prior to electrochemically removing any oxide on the workpiece surface. 
     
     
         12 . The system of  claim 10  further including a first rinsing station for rinsing the workpiece between electrochemically removing any oxide on the workpiece surface and electroplating the workpiece surface. 
     
     
         13 . The system of  claim 10  further including a second rinsing station for rinsing the workpiece surface after electroplating. 
     
     
         14 . The system of  claim 10  in which the first waveform is a pulsed reverse waveform. 
     
     
         15 . The system of  claim 10  in which the workpiece is aluminum, titanium, silicon, or other oxide forming conductive materials/alloys. 
     
     
         16 . The system of  claim 10  in which the plating material is a zinc-nickel alloy, nickel, nickel phosphorus, or other platable elements/alloys. 
     
     
         17 . The system of  claim 10  in which the first electrolyte solution includes sodium chloride, sodium bromide, sodium fluoride, sulfuric acid, sodium sulfate, and/or potassium hydroxide, and/or other water-soluble salts. 
     
     
         18 . The system of  claim 10  in which the second electrolyte solution includes hydrochloric acid, water, and/or boric acid or other constituents required to deposit a given material.