Film and methods of forming same

Abstract

A film and method of forming a film provides an unmodified starting layer of a starting material, the starting layer having opposed first and second surfaces and an initial thickness, T1, and a modified surface layer of thickness T2, which is less than T1, formed in at least a portion of the second surface, wherein a portion of the modified surface layer is not supported by unmodified starting material removed from the first surface opposite the modified surface layer.

1 . A film made by the method of:
 providing a starting layer of a starting material, the starting layer having opposed first and second surfaces and an initial thickness, T 1 , thicker than a desired final film thickness, T 2 ;   providing a support layer having an opening;   supporting the starting layer on the support layer, suspending the first surface across the opening;   irradiating a portion of the second surface over the opening with a non-photonic,   accelerated energetic particle beam to modify the irradiated surface portion to a depth of thickness T 2 ; and   treating the first surface of the irradiated starting layer with a solvent to remove unmodified starting material and to leave a film of thickness T 2  over at least a portion of the opening.   
     
     
         2 . The film of  claim 1 , wherein the support layer is a TEM grid or a pellicle support. 
     
     
         3 . A modified film, comprising:
 an unmodified starting layer of a starting material, the starting layer having opposed first and second surfaces and an initial thickness, T 1 ; and   a modified surface layer of thickness T 2 , which is less than T 1 , formed in at least a portion of the second surface,   wherein a portion of the modified surface layer is not supported by unmodified starting material removed from the first surface opposite the modified surface layer.   
     
     
         4 . The modified film of  claim 3 , further comprising a support layer attached to the first surface of the starting layer, the support layer having an opening aligned under the portion of the second surface. 
     
     
         5 . The modified film of  claim 3 , wherein the starting layer is a film or membrane. 
     
     
         6 . The modified film of  claim 3 , wherein the modified film is a TEM support film or a pellicle film. 
     
     
         7 . The modified film of  claim 3 , wherein the starting material is a polymer, poly(vinyl formal) or polydimethylsiloxane. 
     
     
         8 . The modified film of  claim 3 , wherein the modified surface layer is carbon enriched or silicon enriched. 
     
     
         9 . The modified film of  claim 3 , wherein the modified surface layer is less than or equal to 3 nm thick.