US2020393726A1PendingUtilityA1

Liquid crystal display device

Assignee: JAPAN DISPLAY INCPriority: Apr 28, 2017Filed: Sep 1, 2020Published: Dec 17, 2020
Est. expiryApr 28, 2037(~10.8 yrs left)· nominal 20-yr term from priority
G02F 1/13629G02F 1/134345G02F 1/133368G02F 1/133345G02F 2201/501G02F 1/133788G02F 1/1368G02F 1/1339G02F 1/13452G02F 1/133723G02F 1/136286G02F 1/1345G02F 2001/134345G02F 2001/133368G02F 2001/13629
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Claims

Abstract

According to one embodiment, a liquid crystal display device includes a first substrate including a first area and a second area, a second substrate opposing the first substrate but not opposing the second area, a sealing part which adheres the first substrate and the second substrate to each other, a liquid crystal layer located between the first substrate and the second substrate and surrounded by the sealing part, an alignment film disposed on the first substrate so as to be in contact with the liquid crystal layer and a terminal located in the second area and connected to an external circuit. In plan view, the alignment film includes an end located between the sealing part and the terminal.

Claims

exact text as granted — not AI-modified
1 - 20 . (canceled) 
     
     
         21 . A manufacturing method of a liquid crystal display device comprising:
 preparing a first substrate having a first area and a second area,   the preparing the first substrate comprising:   forming a wiring structure being located in the second area and is thicker than other parts in the second area, and   forming an alignment film covering an entire surface of the first substrate including the first area and the second area;   preparing a second substrate opposing the first area of the first substrate; and   attaching the first substrate and the second substrate by a sealing material that forming a frame shape while interposing a liquid crystal layer between the first substrate and the second substrate,   wherein the alignment film forming step comprises a removing step,   the removing step comprises a part of the alignment film in the second area is removed by an ashing process, and   wherein an end of the alignment film forming by the ashing process is located on the wiring structure.   
     
     
         22 . The manufacturing method of  claim 21 , wherein
 the wiring structure is formed from a first wiring line, a second wiring line, a third wiring line, a first insulating film, a second insulating film and a third insulating film,   the first insulating film located between the first wiring line and the second wiring line,   the third insulating film coves the third wiring line, and   the second insulating film is formed of an organic material and located between the second wiring line and the third wiring line.   
     
     
         23 . The manufacturing method of  claim 21 , wherein
 the first alignment film comprises a thin film portion on the wiring structure thinner than other parts in the second area.   
     
     
         24 . The manufacturing method of  claim 21 , wherein
 a thickness of the end of the alignment film decreases toward an end of the first substrate.   
     
     
         25 . The manufacturing method of  claim 21 , wherein
 a thickness of the second substrate is 300 μm or less.   
     
     
         26 . The manufacturing method of  claim 21 , wherein
 the alignment film comprises a photolytic alignment film.   
     
     
         27 . The manufacturing method of  claim 21 , wherein
 the alignment film comprises a first layer in contact with the liquid crystal layer and a second layer disposed below the first layer, and at least the first layer is formed from a photolytic material.

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