Composition for pretreatment for electroless plating, pretreatment method for electroless plating, and electroless plating method

Abstract

The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.

1 - 6 . (canceled) 
     
     
         7 . An electroless plating method for a resin material, the method comprising
 (1) step 1: bringing the surface to be treated of the resin material into contact with a pretreatment composition, and   (2) step 2: bringing the surface to be treated of the resin material into contact with an electroless plating solution, wherein   the pretreatment composition contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions, and   the pretreatment composition has a pH of 2 or less,   the method not comprising a catalyst-adding step.   
     
     
         8 . The electroless plating method according to  claim 7 , wherein the electroless plating solution contains a reducing agent that is catalytically active on silver. 
     
     
         9 . The electroless plating method according to  claim 7 , wherein manganese of the manganese ions has a valence of 3 or more. 
     
     
         10 . The electroless plating method according to  claim 8 , wherein manganese of the manganese ions has a valence of 3 or more.