Ecological multilayer structure for hosting electronics and related method of manufacture

Abstract

Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

1 .- 17 . (canceled) 
     
     
         18 . An integrated multilayer structure for hosting electronics, comprising:
 a 3d-formable first substrate fabricated from a substantially electrically-insulative, organic material, the first substrate having a first side, and an opposite second side;   a plastic layer molded onto the second side of the first substrate to at least partially cover the first substrate, the plastic layer having a first side that faces the second side of the first substrate, and an opposite second side;   a second substrate disposed on the second side of the plastic layer; and   a light source and associated circuitry disposed on the second substrate, wherein the organic material of the first substrate comprises opaque material being at least locally configured to have a reduced thickness area to enable light emitted by the light source to glow through the first substrate and thereby towards an environment of the integrated multilayer structure on the first side of the first substrate.   
     
     
         19 . The integrated multilayer structure according to  claim 18 , wherein the second substrate is plastic. 
     
     
         20 . The integrated multilayer structure according to  claim 18 , wherein the second substrate has a first side, and an opposite second side, the plastic layer being disposed on the second side of the second substrate such that the plastic layer is disposed between the first and second substrates. 
     
     
         21 . The integrated multilayer structure according to  claim 20 , wherein the light source and associated circuitry are disposed on the second side of the second substrate and embedded in the plastic layer. 
     
     
         22 . The integrated multilayer structure according to  claim 18 , wherein the second substrate is a thermoplastic film. 
     
     
         23 . The integrated multilayer structure according to  claim 18 , further comprising another light source disposed on the second side of the first substrate. 
     
     
         24 . The integrated multilayer structure according to  claim 23 , wherein the another light source is at least partially embedded in the plastic layer. 
     
     
         25 . The integrated multilayer structure according to  claim 18 , wherein the light source is an LED. 
     
     
         26 . The integrated multilayer structure according to  claim 18 , wherein the substantially electrically-insulative, organic material is selected from the group consisting of: wood, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural textile or fabric material, cotton, wool, linen, and silk. 
     
     
         27 . The integrated multilayer structure according to  claim 18 , wherein the first substrate is thermoformable. 
     
     
         28 . The integrated multilayer structure according to  claim 18 , wherein the overall structure exhibits a substantially non-planar, three-dimensional shape. 
     
     
         29 . The integrated multilayer structure according to  claim 18 , wherein the second substrate defines a through-hole extending from a first side thereof to a second side thereof to allow light to pass therethrough. 
     
     
         30 . The integrated multilayer structure according to  claim 18 , wherein the second substrate has a portion of a reduced thickness configured to allow light from the light source to pass therethrough. 
     
     
         31 . The integrated multilayer structure according to  claim 30 , wherein the thickness of the portion of the second substrate is less than about 2 mm. 
     
     
         32 . The integrated multilayer structure according to  claim 18 , wherein the first substrate has a thickness less than about 0.5 mm. 
     
     
         33 . The integrated multilayer structure according to  claim 18 , further comprising a visual feature attached to the first side of the first substrate. 
     
     
         34 . The integrated multilayer structure according to  claim 18 , further comprising a conductive material electrically connecting the first and second substrates to one another. 
     
     
         35 . An integrated multilayer structure, comprising:
 a 3d-formable first substrate fabricated from a substantially electrically-insulative, organic material, the first substrate having a first side, and an opposite second side;   a plastic layer molded onto the second side of the first substrate to at least partially cover the first substrate, the plastic layer having a first side that faces the second side of the first substrate, and an opposite second side;   a plastic second substrate having a first side disposed on the second side of the plastic layer, and an opposite second side; and   a light source and associated circuitry disposed on the first side of the second substrate and embedded within the plastic layer.   
     
     
         36 . The integrated multilayer structure according to  claim 35 , wherein the organic material of the first substrate comprises opaque material being at least locally configured to have a reduced thickness area to enable light emitted by the light source or another light source of the integrated multilayer structure to glow through the first substrate and thereby towards an environment of the integrated multilayer structure on the first side of the first substrate. 
     
     
         37 . The integrated multilayer structure according to  claim 35 , wherein the second substrate comprises opaque material being at least locally configured to have a reduced thickness area to enable light emitted by the light source or another light source of the integrated multilayer structure to glow through the second substrate and thereby towards an environment of the integrated multilayer structure on the first side of the second substrate.