Substrate carrier and diffusion module thereof

Abstract

This invention proposes a substrate carrier and an air diffusion module thereof. The air diffusion module comprises a cover, at least one air inlet, an airtight layer, an air diffusion layer and an engaging portion. The at least one air inlet is connected with the cover, and the airtight layer is connected with the cover and the at least one air inlet. Furthermore, the air diffusion layer is connected with the cover via the airtight layer, and the engaging portion engages and tightly connected with the cover, the at least one air inlet and the air diffusion layer. The engaging portion is configured on the substrate carrier as a semiconductor container.

What is claimed is: 
     
         1 . An air diffusion module, comprising:
 a cover;   at least one air intake part connected with said cover;   an airtight layer connected with said cover and said at least one intake part;   an air diffusion layer covered by said cover through said airtight layer; and   a bearing portion covered by said cover, said at least one intake part and said air diffusion layer;   wherein said bearing portion is configured on a container.   
     
     
         2 . The air diffusion module of  claim 1 , wherein said cover is configured with a plurality of first locking part. 
     
     
         3 . The air diffusion module of  claim 2 , wherein said bearing portion is configured with a plurality of second locking part corresponding to said plurality of first locking part. 
     
     
         4 . The air diffusion module of  claim 1 , wherein said airtight layer comprises:
 an outer airtight part;   a plurality of airtight locking part arranged on said outer airtight part;   an inner airtight part connected with said outer airtight part; and   at least one intake airtight part connected with said outer airtight part.   
     
     
         5 . The air diffusion module of  claim 1 , wherein said at least one intake part is configured with at least one alignment part. 
     
     
         6 . The air diffusion module of  claim 1 , wherein said air diffusion layer is made of a filter material. 
     
     
         7 . The air diffusion module of  claim 1 , wherein said container is a front opening unified pod. 
     
     
         8 . A substrate carrier, comprising:
 a case provided with an opening;   a door covered with said opening;   at least one air intake located at a bottom of said case;   an air diffusion module which comprises:
 a cover; 
 at least one air intake part connected with said cover and said at least one air intake; 
 an airtight layer connected with said cover and said at least one intake part; 
 an air diffusion layer covered by said cover through said airtight layer; and 
 a bearing portion covered by said cover, said at least one intake part and said air diffusion layer, wherein said bearing portion is configured on said case. 
   
     
     
         9 . The substrate carrier of  claim 8 , wherein said cover is configured with a plurality of first locking part, and wherein said bearing portion is configured with a plurality of second locking part corresponding to said plurality of first locking part. 
     
     
         10 . The substrate carrier of  claim 8 , wherein said substrate carrier is a front opening unified pod.