Ultrasound Transducer Array Interconnect

Abstract

An apparatus ( 100 ) comprises a probe ( 102 ) including a transducer array ( 108 ) with a plurality of elements ( 110 ), a communications interface ( 112 ), and an interconnect ( 114 ) configured to route electrical signals between the plurality of elements and the communications interface. The interconnect includes a flexible printed circuit with a first surface with a first metal layer ( 406, 1210 1 ), a second opposing surface with a second metal layer ( 408, 1210 2 ), a first end ( 432, 1305 ), and a second opposing end ( 434, 1307 ). The apparatus further includes traces ( 430, 440, 1304, 1306, 1502, 1804 ) configured to readout signals from at least one of the first and second opposing ends.

What is claimed is: 
     
         1 . A probe, comprising:
 a multi-row transducer, including an active layer with three rows in an elevation direction, including an end row, a middle row and an opposing end row, wherein each of the three rows includes a plurality of elements in an azimuth direction;   a communications interface; and   an interconnect disposed under the multi-row transducer, the interconnect, including a flexible printed circuit configured to route electrical signals between the plurality of elements of the three rows and the communications interface.   
     
     
         2 . The probe of  claim 1 , wherein the flexible printed circuit comprises:
 a top layer with three sets of pads, including a first set of pads for the end row, a second set of pads for the middle row and a third set of pads for the opposing end row; and   a bottom layer, including:
 a first end; 
 a second opposing end; 
 a first set of traces at the first end and electrically connected to the second set of pads for the middle row; and 
 a second set of traces at the second opposing end and electrically connected to the first set of pads for the end row and the third set of pads for the opposing end row. 
   
     
     
         3 . The probe of  claim 2 , wherein a pair of traces, including a trace of the first set of traces and a trace of the third set of traces, is disposed in parallel under at least the third sets of pads. 
     
     
         4 . The probe of  claim 3 , wherein the pair of traces is entirely under the third set of pads. 
     
     
         5 . The probe of  claim 3 , further comprises:
 a plurality of vias, including:
 a first set of vias configured to connect the second set of pads for the middle row to the first set of traces; and 
 a second set of vias configured to connect the first set of pads for the end row and the third set of pads for the opposing end row to the second set of traces. 
   
     
     
         6 . The probe of  claim 5 , wherein a pitch of the first and second sets of traces is less than half a pitch of the first, second and third set of pads. 
     
     
         7 . The probe of  claim 1 , wherein the flexible printed circuit comprises:
 a top layer with three sets of pads, including a first set of pads for the end row, a second set of pads for the middle row and a third set of pads for the opposing end row; and   a bottom layer, including:
 a first end; 
 a second opposing end; 
 a first set of traces at the first end and electrically connected to the second set of pads for the middle row; 
 a second set of traces at the second opposing end and electrically connected to the first set of pads for the end row; and 
 a third set of traces at the second opposing end and electrically connected to the third set of pads for the opposing end row. 
   
     
     
         8 . The probe of  claim 7 , further comprises:
 a plurality of vias, including:
 a first set of vias configured to connect the second set of pads for the middle row to the first set of traces; 
 a second set of vias configured to connect the first set of pads for the end row to the second set of traces; and 
 a third set of vias configured to connect the third set of pads for the opposing end row to the third set of traces. 
   
     
     
         9 . The probe of  claim 8 , wherein each of the three rows is controlled independent of the other rows of the three rows. 
     
     
         10 . The probe of  claim 8 , wherein a pair of traces, including a trace of the first set of traces and a trace of the third set of traces, is disposed in parallel under the third sets of pads, wherein a trace of the first set of traces is disposed under the second sets of pads; and wherein a trace of the second set of traces is disposed under the first sets of pads. 
     
     
         11 . The probe of  claim 1 , wherein the active layer further comprises a first intermediary row dispose between the end row and the middle row and a second intermediary row disposed between the middle row and the opposing end row, and the top layer includes a fourth set of pads for the first intermediary row and a fifth set of pads for the second intermediary row. 
     
     
         12 . The probe of  claim 11 , further comprising:
 a fourth set of traces for the to the first intermediary row, wherein the fourth set of traces are extensions of the fourth set of pads; and   a fifth set of traces for the to the second intermediary row, wherein the fifth set of traces are extensions of the fifth set of pads.   
     
     
         13 . The probe of  claim 1 , wherein the interconnect is in electrical communication with the active layer through discrete conductive pads. 
     
     
         14 . The probe of  claim 1 , wherein the flexible printed circuit include multiple layers. 
     
     
         15 . The probe of  claim 14 , further comprising:
 a backing, wherein the multiple layers are in a planar configuration between the active layer and the backing.   
     
     
         16 . The probe of  claim 1 , wherein the top layer includes at least one trace. 
     
     
         17 . A method, comprising:
 receiving ultrasound echo signals with a multi-row transducer of a probe, wherein the multi-row transducer includes an active layer with three rows in an elevation direction, including an end row, a middle row and an opposing end row, and each of the three rows includes a plurality of elements in an azimuth direction;   generating electrical signals indicative of the received ultrasound echo signals;   interconnecting, via an interconnect, the multi-row transducer with a communications interface of the probe, wherein the interconnect includes a flexible printed circuit disposed under the multi-row transducer;   routing, with the interconnect, the electrical signals to the communications interface.   
     
     
         18 . The method of  claim 17 , further comprising:
 routing signals from the middle row to one side of the interconnect; and   routing signals from the end row and the opposing end row to an opposing side of the interconnect.   
     
     
         19 . The method of  claim 17 , further comprising:
 routing signals from the middle row to one side of the interconnect; and   routing signals from the end row and the opposing end row to different sides of the interconnect.   
     
     
         20 . The method of  claim 17 , further comprising:
 routing, with the communications interface, the electrical signals to processing circuitry configured to process the electrical signals and generate an image.