US2021017036A1PendingUtilityA1

Film-forming material

Assignee: NIPPON YTTRIUM CO LTDPriority: Dec 28, 2015Filed: Oct 1, 2020Published: Jan 21, 2021
Est. expiryDec 28, 2035(~9.4 yrs left)· nominal 20-yr term from priority
H01J 37/32477C01P 2002/74C01P 2002/72C01F 17/265C01P 2004/62C01P 2004/61C01F 17/218C23C 14/06C23C 4/04C23C 24/04C23C 14/48C23C 4/12C01F 17/00C23C 14/32
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Claims

Abstract

A film-forming material of the present invention contains an oxyfluoride of yttrium represented by YOXFY (X and Y are numbers satisfying 0<X and X<Y) and YF3, wherein a ratio I2/I1 of a peak height I2 of the (020) plane of YF3 to a peak height I1 of the main peak of YOXFY as analyzed by XRD is from 0.005 to 100. It is preferable that a ratio I4/I1 of a peak height I4 of the main peak of Y2O3 to the peak height I1 of the main peak of YOXFY as analyzed by XRD is 0.01 or less.

Claims

exact text as granted — not AI-modified
1 . A film-forming material comprising:
 an yttrium oxyfluoride represented by YO 0.8 F 1.4  and YF 3 ,   wherein a ratio I 2 /I 1  of a peak height I 2  of the (020) plane of the YF 3  to a height I 1  of a main peak of the YO 0.8 F 1.4  as analyzed by XRD is from 0.01 to 3,   and the film-forming material is obtained by firing a granulated product which is obtained by granulating a powder containing YO 0.8 F 1.4  and YF 3 , and the average particle size D50 of the film-forming material is 0.1 μm to 9 μm.   
     
     
         2 . The film-forming material according to  claim 1 , wherein an oxygen content in the film-forming material is from 0.5 to 11.0 mass %. 
     
     
         3 . The film-forming material according to  claim 1 , wherein a ratio I 3 /I 1  of a peak height I 3  of a main peak of YOF to the peak height I 1  of the main peak of the YO 0.8 F 1.4  as analyzed by XRD is 0.5 or less. 
     
     
         4 . The film-forming material according to  claim 1 , wherein a ratio I 4 /I 1  of a peak height I 4  of a main peak of Y 2 O 3  to the peak height I 1  of the main peak of the YO 0.8 F 1.4  as analyzed by XRD is 0.01 or less. 
     
     
         5 . The film-forming material according to  claim 1 , wherein the film-forming material is in granular form. 
     
     
         6 . The film-forming material according to  claim 1 , wherein the film-forming material is used for a thermal spraying method. 
     
     
         7 . The film-forming material according to  claim 1 , wherein the film-forming material is used for an aerosol deposition method. 
     
     
         8 . The film-forming material according to  claim 1 , wherein the film-forming material is used for an ion plating method. 
     
     
         9 . A method for producing a film, which comprises a step of thermal spraying the film-forming material according to  claim 1 . 
     
     
         10 . A method for producing a film, which comprises a step of aerosol depositing the film-forming material according to  claim 1 . 
     
     
         11 . A method for producing a film, which comprises a step of ion plating the film-forming material according to  claim 1 .

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