Thermal management method and apparatus for high frequency ic with apertured heat sink

Abstract

An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.

What is claimed is: 
     
         1 . An integrated circuit system comprising:
 a die containing high frequency circuitry operating at mm-wave frequencies, the die also having a first side and a second side;   a plurality of interfaces on the first side, the plurality of interfaces being in electrical communication with the high frequency circuitry;   a heat sink having a bottom surface with a first region and an aperture region, the aperture region forming a concavity with an inner concave surface that is spaced from the die; and   a thermal interface material between the bottom surface of the heat sink and the die to facilitate thermal communication between the heat sink and the die.   
     
     
         2 . The integrated system of  claim 1  wherein the thermal interface material comprises a thermal grease. 
     
     
         3 . The integrated system of  claim 1  wherein the thermal interface material comprises a thermally conductive adhesive. 
     
     
         4 . The integrated system of  claim 1  wherein the thermal interface material comprises a given material that physically connects the heat sink with the die to form a thermal conductive connection between the heat sink and the die. 
     
     
         5 . The integrated system of  claim 1  wherein the thermal interface material is between the first region of the heat sink and the die. 
     
     
         6 . The integrated circuit system of  claim 1  wherein the aperture region is adjacent to the second side of the die. 
     
     
         7 . The integrated circuit system of  claim 1  wherein the aperture region forms a concavity having an elliptical shape. 
     
     
         8 . The integrated circuit system of  claim 1  wherein the aperture region forms a concavity having an irregular shape. 
     
     
         9 . The integrated circuit system of  claim 1  wherein the aperture region forms a concavity having a non-elliptical shape. 
     
     
         10 . The integrated circuit system of  claim 1  wherein the first region is substantially planar. 
     
     
         11 . The integrated system of  claim 1  wherein the high frequency circuitry is configured to operate at mm-wave frequencies of between and including about 10 GHz and 90 GHz. 
     
     
         12 . An integrated circuit system comprising:
 a die containing high frequency circuitry operating at mm-wave frequencies, the die also having a first side and a second side, the first side of the die being opposed to the second side of the die;   a plurality of interfaces on the first side, the plurality of interfaces being in electrical communication with the high frequency circuitry;   a heat sink having a bottom surface with a first region and an aperture region, the aperture region forming a concavity with an inner concave surface that is spaced from the die; and   a thermal interface material between the bottom surface of the heat sink and the second side of the die to facilitate thermal communication between the heat sink and the die, the thermal interface material comprising one or more of a thermal grease and a thermally conductive adhesive.   
     
     
         13 . The integrated system of  claim 11  wherein the thermal interface material is between the first region of the heat sink and the second side of the die. 
     
     
         14 . The integrated circuit system of  claim 11  wherein the aperture region is adjacent to the second side of the die. 
     
     
         15 . The integrated circuit system of  claim 11  wherein the aperture region forms a concavity having an elliptical shape or an irregular shape. 
     
     
         16 . The integrated circuit system of  claim 11  wherein the thermal interface material comprises means for transmitting heat from the die toward the heat sink. 
     
     
         17 . A method of forming an integrated circuit system, the method comprising:
 providing a die containing high frequency circuitry operating at mm-wave frequencies, the die also having a first side and a plurality of interfaces on the first side, the plurality of interfaces being in electrical communication with the high frequency circuitry;   providing a heat sink having a bottom surface with a first region and an aperture region, the aperture region forming a concavity with an inner concave surface that is spaced from the die; and   positioning a thermal interface material between the bottom surface of the heat sink and the die to facilitate thermal communication between the heat sink and the die.   
     
     
         18 . The method of  claim 17  wherein the thermal interface material comprises a thermal grease. 
     
     
         19 . The method of  claim 17  wherein the thermal interface material comprises a thermally conductive adhesive. 
     
     
         20 . The method of  claim 17  wherein the thermal interface material comprises a given material that physically connects the heat sink with the die to form a thermal conductive connection between the heat sink and the die.