Flexible and conformable polymer-based heat sinks and methods of making and using thereof

Abstract

Heat sinks containing polymeric protrusions on a base and optionally further including a foil or tape, as well as methods of making and using thereof, are described herein.

We claim: 
     
         1 . A plastic heat sink comprising:
 a plurality of polymeric protrusions extending away from a base; wherein the plurality of polymeric protrusions and/or the base are formed from a polymer having a thermal conductivity in the range of between about 0.01 to 0.5 W/m-K; and   wherein the base has a thickness ranging from between about 0.1 to 3 mm, 0.1 to 2 mm, 0.1 to 1 mm, or 0.5 to 1 mm.   
     
     
         2 . The plastic heat sink of  claim 1 , wherein the plurality of polymeric protrusions are formed from a melt processable or an extrudable polymer. 
     
     
         3 . The plastic heat sink of  claim 1 , wherein the plurality of polymeric protrusions are formed from thermoplastic polymers, elastomeric polymers, thermoset polymers, thermoplastic elastomers, and combinations thereof. 
     
     
         4 . The plastic heat sink of  claim 1 , wherein the plurality of polymeric protrusions are formed from a polymer selected from the group consisting of polycarbonates, nylons, polypropylenes, polyethylene terephthalate, polyurethanes, styrene-ethylene-butylene-styrene, and blends thereof. 
     
     
         5 . The plastic heat sink of  claim 1 , wherein the polymeric protrusions and/or the base can each independently have a thermal conductivity in a range from between about 0.01 to 0.5 W/m-K or less than about 0.5 W/m-K, 0.4 W/m-K, 0.3 W/m-K, 0.2 W/m-K, or 0.1 W/m-K. 
     
     
         6 . The plastic heat sink of  claim 1 , wherein the plastic heat sink has a thermal conductivity in a range from between about 0.01 to 0.5 W/m-K or less than about 0.5 W/m-K, 0.4 W/m-K, 0.3 W/m-K, 0.2 W/m-K, or 0.1 W/m-K. 
     
     
         7 . The plastic heat sink of  claim 1 , wherein the polymeric protrusions and the base are free or substantially free of additives that increase thermal conductivity. 
     
     
         8 . The plastic heat sink of  claim 1 , wherein the plastic heat sink is flexible and conformable. 
     
     
         9 . The plastic heat sink of  claim 1 , wherein the thickness of the base is about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2, 2.5, or 3 mm. 
     
     
         10 . The plastic heat sink of  claim 1 , wherein a ratio of the base thickness to the polymeric protrusions height is at least 1:4, at least 1:5, at least 1:6, at least 1:7, at least 1:8, at least 1:9, or at least 1:10. 
     
     
         11 . The plastic heat sink of  claim 1 , wherein the polymeric protrusions which are adjacent have center-to-center separation distances in a range of between about 3 to 15 mm, 5 to 15 mm, 5 to 10 mm or are at least about 5, 6, 7, 8, 9, or 10 mm. 
     
     
         12 . The plastic heat sink of  claim 1 , wherein the base includes one or more additional layers thereon opposite the surface having thereon the polymeric protrusions. 
     
     
         13 . The plastic heat sink of  claim 12 , wherein the one or more additional layers is a foil or tape. 
     
     
         14 . The plastic heat sink of  claim 13 , wherein the foil or tape comprises aluminum, copper, alloys thereof, graphite, a crystalline polymer, or combinations thereof. 
     
     
         15 . The plastic heat sink of  claim 13 , wherein the foil or tape has a thermal conductivity in a range from between about 5 to 1800 W/m-K, 5 to 700 W/m-K, 5 to 400 W/m-K, 5 to 200 W/m-K, 5 to 150 W/m-K, 5 to 100 W/m-K, 10 to 75 W/m-K, or 5 to 100 W/m-K; or of at least about 10 W/m-K, 20 W/m-K, 30 W/m-K, 40 W/m-K, 50 W/m-K, 60 W/m-K, 70 W/m-K 80 W/m-K, or 100 W/m-K. 
     
     
         16 . A method of making the plastic heat sink according to  claim 1 , the method comprising the steps of:
 (a) forming a base and a plurality of polymeric protrusions on at least a surface of the base;   wherein the plurality of polymeric protrusions and/or the base are formed from a polymer having a thermal conductivity in the range of between about 0.01 to 0.5 W/m-K; and   wherein the base has a thickness ranging from between about 0.1 to 3 mm, 0.1 to 2 mm, 0.1 to 1 mm, or 0.5 to 1 mm.   
     
     
         17 . The method of  claim 16 , wherein the plurality of polymeric protrusions are formed from a melt processable or an extrudable polymer. 
     
     
         18 . The method of  claim 16 , wherein the plurality of polymeric protrusions are formed from thermoplastic polymers, elastomeric polymers, thermoset polymers, thermoplastic elastomers, and combinations thereof. 
     
     
         19 . The method of  claim 16 , wherein the plurality of polymeric protrusions are formed from a polymer selected from the group consisting of polycarbonates, nylons, polypropylenes, polyethylene terephthalate, polyurethanes, styrene-ethylene-butylene-styrene, and blends thereof. 
     
     
         20 . The method of  claim 16 , wherein the plurality of polymeric protrusions have tapered sidewalls. 
     
     
         21 . The method of  claim 16 , wherein the polymeric protrusions or the base can each have a thermal conductivity in a range from between about 0.01 to 0.5 W/m-K or less than about 0.5 W/m-K, 0.4 W/m-K, 0.3 W/m-K, 0.2 W/m-K, or 0.1 W/m-K. 
     
     
         22 . The method of  claim 16 , wherein the plastic heat sink has a thermal conductivity in a range from between about 0.01 to 0.5 W/m-K or less than about 0.5 W/m-K, 0.4 W/m-K, 0.3 W/m-K, 0.2 W/m-K, or 0.1 W/m-K. 
     
     
         23 . The method of  claim 16 , wherein the polymeric protrusions and the base are free or substantially free of additives that increase thermal conductivity. 
     
     
         24 . The method of  claim 16 , wherein the plastic heat sink is flexible and conformable. 
     
     
         25 . The method of  claim 16 , wherein the thickness of the base is about 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.5, 2, 2.5, or 3 mm. 
     
     
         26 . The method of  claim 16 , wherein a ratio of the base thickness to the polymeric protrusions height is at least 1:4, at least 1:5, at least 1:6, at least 1:7, at least 1:8, at least 1:9, or at least 1:10. 
     
     
         27 . The method of  claim 16 , wherein the polymeric protrusions which are adjacent have center-to-center separation distances in a range of between about 3 to 15 mm, 5 to 15 mm, 5 to 10 mm or are at least about 5, 6, 7, 8, 9, or 10 mm. 
     
     
         28 . The method of  claim 16 , wherein a sheet of the formed heat sink of step (a) is cut into a dimension and/or shape. 
     
     
         29 . The method of  claim 28 , wherein the cut heat sink has a repeating geometry of protruding pins which is the same as the sheet of the formed heat sink of step (a). 
     
     
         30 . The method of  claim 16 , further comprising the step of:
 (b) attaching, adhering, or bonding to the base a foil or tape on a surface opposite the surface comprising the plurality of polymeric protrusions.   
     
     
         31 . The method of  claim 30 , wherein the foil or tape comprises aluminum, copper, alloys thereof, graphite, a crystalline polymer, or combinations thereof. 
     
     
         32 . The method of  claim 30 , wherein the foil or tape has a thermal conductivity in a range of between about 5 to 1800 W/m-K, 5 to 700 W/m-K, 5 to 400 W/m-K, 5 to 100 W/m-K, 10 to 100 W/m-K, 10 to 75 W/m-K, or 5 to 100 W/m-K; or of at least about 10 W/m-K, 20 W/m-K, 30 W/m-K, 40 W/m-K, 50 W/m-K, 60 W/m-K, 70 W/m-K, 80 W/m-K, or 100 W/m-K. 
     
     
         33 . The method of  claim 30 , wherein a sheet of the formed heat sink following step (b) is cut into a dimension and/or shape. 
     
     
         34 . The method of  claim 30 , wherein a sheet of the formed heat sink following step (a) is cut into a dimension and/or shape and then step (b) is subsequently performed. 
     
     
         35 . The method of  claim 34 , wherein the foil or tape of step (b) has the same dimension and/or shape as the cut heat sink prior to performing step (b). 
     
     
         36 . The method of  claim 33 , wherein the cut heat sink has a repeating geometry of protruding pins which is the same as the sheet of the formed heat sink following step (b). 
     
     
         37 . A device comprising the plastic heat sink of  claim 1 . 
     
     
         38 . The device of  claim 37 , wherein the plastic heat sink conforms to one or more surfaces of the device. 
     
     
         39 . The device of  claim 37 , wherein the device comprises a heat source or is a heat-generating device or a component thereof. 
     
     
         40 . The device of  claim 37 , wherein the heat source or the heat-generating device or component thereof is a computer chip, computer module, a multi-component system, memory module, graphics chip, radar and radio-frequency (RF) device, disc drive, display, light-emitting diode (LED) display, lighting device, pipe, automotive control unit, solar cell, solar panel, electromagnetic interference (EMI) enclosures, battery, communications device, thermoelectric generator, an imaging device, cellular phone, tablet or handheld computer, power or signal amplifier, AC/DC converter or other power electronics device. 
     
     
         41 . The device of  claim 37 , wherein the device comprises or is a system or apparatus for heat rejection. 
     
     
         42 . The device of  claim 41 , wherein the system or apparatus for heat rejection is a radiator on a spacecraft.