Nonconductive Modular Barrier Assemblies

Abstract

As described herein the invention includes a nonconductive barrier that has a first undulating panel and a second undulating panel each having an undulation profile, and each having a first vertical edge, a second vertical edge and a back surface, and at least one, preferably two, stabilizing members that extend from the back surface of the undulating panel. The first vertical edge of the second panel is capable of engaging with the second vertical edge of the first panel to form a nonconductive barrier. Each of the panels and member(s) independently comprises a nonconductive material. In an embodiment, the first vertical edge of the second panel includes a groove extending downwardly along the vertical edge from a top of the second panel to a bottom of the second panel. The groove is defined by a first loop and a second loop, each of which extends from the first vertical edge, the groove terminating in a groove aperture. The second vertical edge of the first panel terminated in a tongue member, wherein the tongue member is configured to be slidably insertable into the groove via the aperture. Also include are related methods and enclosures that employ and/or are formed by the barrier assemblies of the invention.

What is claimed is: 
     
         1 . A nonconductive barrier comprising
 a. An first undulating panel and a second undulating panel each having an undulation profile, and each having a first vertical edge, a second vertical edge and a back surface;   b. At least one stabilizing member extending from the back surface of the undulating panel,   
       wherein the first vertical edge of the second panel is capable of engaging with the second vertical edge of the first panel to form a nonconductive barrier and wherein each of the panels and member(s) independently comprises a nonconductive material. 
     
     
         2 . The nonconductive barrier of  claim 1  wherein each of the panels and member(s) is nonconductive. 
     
     
         3 . The nonconductive barrier of  claim 1 , wherein
 a. the first vertical edge of the second panel includes a groove extending downwardly along the vertical edge from a top of the second panel to a bottom of the second panel, the groove defined by a first loop and a second loop, each of which extends from the first vertical edge, the groove terminating in a groove aperture;   b. the second vertical edge of the first panel terminated in a tongue member, wherein the tongue member is configured to be slidably insertable into the groove via the aperture.   
     
     
         4 . The nonconductive barrier of  claim 1  wherein each panel further comprises at least two spaced apart stabilizing members. 
     
     
         5 . The nonconductive barrier of  claim 1  wherein the stabilizer member comprises a first element that extends from a back surface of the undulating panel terminating in a distal end and a second member extending from the distal end, wherein an angle formed between the first element and the second element is less than about 180 degrees. 
     
     
         6 . The nonconductive barrier of  claim 1  wherein the stabilizer member comprises a first element that extends from a back surface of the undulating panel terminating in a distal end and a second member extending from the distal end, wherein an angle formed between the first element and the second element is less than about 120 degrees. 
     
     
         7 . The nonconductive barrier of  claim 5 , wherein the stabilizing member further includes a third element that extends from a distal end of the second element, wherein an angle formed between the second element and the third element is less than about 180 degrees. 
     
     
         8 . The nonconductive barrier of  claim 6 , wherein the stabilizing member further includes a third element that extends from a distal end of the second element, wherein an angle formed between the second element and the third element is less than about 120 degrees. 
     
     
         9 . The nonconductive barrier of  claim 1  wherein each panel independently has an undulation profile selected from profiles having 1, 2, 3, 4, and 5 undulations. 
     
     
         10 . The nonconductive barrier of  claim 1  wherein each panel independently has an undulation profile selected from profiles having a C-format, a V-format, and a flattened-V format. 
     
     
         11 . The nonconductive barrier of  claim 1  wherein the panel independently has a length/x dimension of about 5 feet to about 100 feet. 
     
     
         12 . The nonconductive barrier of  claim 1  wherein the panel independently has a length/x dimension of about 15 feet to about 75 feet. 
     
     
         13 . The nonconductive barrier of  claim 1  wherein the panel independently has a vertical/y dimension of about 4 to about 30 feet. 
     
     
         14 . The nonconductive barrier of  claim 1  wherein the panel independently has a height/y dimension of about 10 to about 20 feet. 
     
     
         15 . The nonconductive barrier of  claim 1  wherein the panel independently has a width/x dimension of about 1 inch to about 8 inches. 
     
     
         16 . The nonconductive barrier of  claim 1  wherein the panel independently has a width/x dimension of about 4 inches to about 6 inches. 
     
     
         17 . The barrier assembly of  claim 1  wherein the material is selected from fiberglass, a polymer, glass, asphalt, rubber, and plastic. 
     
     
         18 . An enclosure comprising the barrier assemblies of  claim 1 , wherein a first vertical edge of the first barrier assembly is attached to a second vertical edge of a second barrier assembly.