US2021124241A1PendingUtilityA1

Image capturing module

65
Assignee: SZ DJI TECHNOLOGY CO LTDPriority: Aug 29, 2014Filed: Jan 4, 2021Published: Apr 29, 2021
Est. expiryAug 29, 2034(~8.1 yrs left)· nominal 20-yr term from priority
H04N 23/57B64D 47/08G03B 17/55H05K 7/2039H05K 5/0213G03B 15/006G03B 17/561H05K 5/0052G03B 17/02G03B 15/04H05K 7/20136H04N 5/2257
65
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An apparatus includes a camera unit and a circuit board unit connected to the camera unit and disposed at a periphery of the camera unit. The circuit board unit includes a plurality of rigid boards and at least one flexible board connecting the plurality of rigid boards. The plurality of rigid boards are disposed on different side portions of the camera unit by bending the at least one flexible board.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An apparatus, comprising:
 a camera unit; and   a circuit board unit connected to the camera unit and disposed at a periphery of the camera unit, the circuit board unit comprising:
 a plurality of rigid boards, and 
 at least one flexible board connecting the plurality of rigid boards, wherein the plurality of rigid boards are disposed on different side portions of the camera unit by bending the at least one flexible board. 
   
     
     
         2 . The apparatus of  claim 1 , wherein the at least one flexible board is configured to connect the plurality of rigid boards to each other mechanically and electrically. 
     
     
         3 . The apparatus of  claim 1 , wherein the at least one flexible board includes bendable circuits. 
     
     
         4 . The apparatus of  claim 1 , wherein the circuit board unit further comprises a functional module arranged on one of the plurality of rigid boards. 
     
     
         5 . The apparatus of  claim 4 , wherein the functional module comprises at least an image processor, and the functional module is configured to perform at least one of image transmission, power management, or gimbal control. 
     
     
         6 . The apparatus of  claim 4 , further comprising a heat dissipation device, the heat dissipation comprising a heat sink attachable to a surface of the functional module for dissipating heat from the functional module. 
     
     
         7 . The apparatus of  claim 6 , wherein the heat sink comprises a base and a plurality of heat dissipation fins formed on the base, the base being connected to the functional module. 
     
     
         8 . The apparatus of  claim 7 , wherein the heat sink further comprises a thermal conduction filler disposed between the base and the functional module. 
     
     
         9 . The apparatus of  claim 1 , further comprising:
 a casing configured to enclose a receiving space for receiving the camera unit and the circuit board unit.   
     
     
         10 . The apparatus of  claim 9 , wherein the casing comprises:
 a first housing body; and   a second housing body attachable to the first housing body, the first housing body and the second housing body configured to enclose the receiving space.   
     
     
         11 . The apparatus of  claim 10 , wherein the first housing body and the second housing jointly define a front opening, and the casing further comprises a front enclosure that closes the front opening. 
     
     
         12 . An imaging device, comprising:
 an optical lens;   an imaging sensing module arranged at an imaging side of the optical lens;   a circuit board unit connected to the imaging sensing module and disposed at a periphery of the optical lens and the imaging sensing module, the circuit board unit comprising:
 a plurality of rigid boards, and 
 at least one flexible board connecting the plurality of rigid boards, wherein the plurality of rigid boards are disposed on different side portions of the optical lens and the imaging sensing module by bending the at least one flexible board; and 
   a casing configured to enclose a receiving space for receiving the optical lens, the imaging sensor module, and the circuit board unit.   
     
     
         13 . The imaging device of  claim 12 , wherein the casing comprises:
 a first housing body; and   a second housing body attachable to the first housing body, the first housing body and the second housing body configured to enclose the receiving space.   
     
     
         14 . The imaging device of  claim 13 , wherein the casing further comprises a mounting portion formed at a joint of the first housing body and the second housing body for mounting the casing to a carrying apparatus. 
     
     
         15 . The imaging device of  claim 13 , wherein the first housing body and the second housing body jointly define a front opening, and the casing further comprises a front enclosure that closes the front opening. 
     
     
         16 . The imaging device of  claim 15 , wherein the front enclosure further includes a ventilating window in communication with the receiving space for ventilating the receiving space. 
     
     
         17 . The imaging device of  claim 15 , wherein the front opening is provided at a joint of the first housing body and the second housing body. 
     
     
         18 . The imaging device of  claim 13 , wherein the first housing body and the second housing body jointly define a back opening, and the casing further comprises a back enclosure that closes the back opening. 
     
     
         19 . The imaging device of  claim 18 , wherein the back enclosure further includes a ventilating window in communication with the receiving space for ventilating the receiving space. 
     
     
         20 . The imaging device of  claim 18 , wherein the back opening is provided at a joint of the first housing body and the second housing body.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.