System and method for measuring blood flow parameters in a blood vessel having an endovascular prosthesis
Abstract
An endovascular prosthesis comprising: a conduit formed by a wall structure surrounding a lumen; a sensor element configured to generate an electrical parameter shift in response to a physical event, the sensor element integrated in the wall structure of the conduit, the wall structure includes at least one wire structure, where at least a part of the wire structure include a first metallic conduit, a second metallic conduit, and a sensor disposed between the first metallic conduit and the second metallic conduit, where the first and second metallic conduits are conductors in a monitoring device detecting the electrical parameter shift in the sensor; wherein the sensor is either a variable capacitive sensor, and the first metallic conduit and the second metallic conduit form the electrodes of the variable capacitor; or a variable resistor configured to generate a resistance change in response to the physical event.
Claims
exact text as granted — not AI-modified1 . An endovascular prosthesis comprising:
a conduit formed by a wall structure surrounding a lumen; and a sensor element configured to generate an electrical parameter shift in response to a physical event, the sensor element integrated in the wall structure of the conduit, the wall structure includes at least one wire structure, where at least a part of the wire structure include a first metallic conduit, a second metallic conduit, and a sensor disposed between the first metallic conduit and the second metallic conduit, where the first and second metallic conduits are conductors in a monitoring device detecting the electrical parameter shift in the sensor;
wherein the sensor is either:
a variable capacitive sensor, and the first metallic conduit and the second metallic conduit form the electrodes of the variable capacitor; or
a variable resistor configured to generate a resistance change in response to the physical event.
2 . The endovascular prosthesis of claim 1 , where the sensor comprises a poled PVDF material configured to generate a voltage change in response to the physical event.
3 . The endovascular prosthesis of claim 2 , where the sensor is enclosed in an encapsulating layer.
4 . The endovascular prosthesis of claim 3 , where the encapsulating layer is a laminate.
5 . The endovascular prosthesis of claim 3 , where the encapsulating layer is made of a composite material.
6 . The endovascular prosthesis of claim 3 , where the encapsulating layer is formed as layer material selected from polyvinylidene difluoride (“PVDF”), a metal, fluorinated ethylene propylene (“FEP”), polytetrafluoroethylene (“PTFE”), parylene, and expanded PTFE.
7 . The endovascular prosthesis of claim 3 , where the encapsulating layer is formed as a laminate structure comprising up to four materials including any combination of titanium oxide, aluminum oxide, tantalum oxide, and silicon nitride.
8 . The endovascular prosthesis of claim 3 , where the encapsulating layer is formed as a composite material consisting of any combination of titanium oxide, aluminum oxide, tantalum oxide, and silicon nitride.
9 . An endovascular prosthesis comprising:
a conduit formed by a wall structure surrounding a lumen; a sensor element configured to generate an electrical parameter shift in response to a physical event, the sensor element integrated in the wall structure of the conduit, the wall structure comprises at least one strut structure, where at least a part of the strut structure includes a first metallic layer, a second metallic layer; and a sensor disposed between the first metallic layer and the second metallic layer, where the first and second metallic layers are conductors in a monitoring device detecting the electrical parameter shift in the sensor material; wherein the sensor is either: a variable capacitive sensor, and the first metallic conduit and the second metallic conduit form the electrodes of the variable capacitor; or a variable resistor configured to generate a resistance change in response to the physical event.
10 . The endovascular prosthesis of claim 9 where the sensor is an insulator for forming a variable capacitive sensor, and the first metallic layer and the second metallic layer form the electrodes of the variable capacitor.
11 . The endovascular prosthesis of claim 9 , where the sensor comprises a poled PVDF material configured to generate a voltage change in response to the physical event.
12 . The endovascular prosthesis of claim 9 , where the sensor is enclosed in an encapsulating layer.
13 . The endovascular prosthesis of claim 12 , where the encapsulating layer is a laminate.
14 . The endovascular prosthesis of claim 12 , where the encapsulating layer is made of a composite material.
15 . The endovascular prosthesis of claim 12 , where the encapsulating layer is formed as layer material selected from polyvinylidene difluoride (“PVDF”), a metal, fluorinated ethylene propylene (“FEP”), polytetrafluoroethylene (“PTFE”), parylene, and expanded PTFE.
16 . The endovascular prosthesis of claim 12 , where the encapsulating layer is formed as a laminate structure comprising up to four materials including any combination of titanium oxide, aluminum oxide, tantalum oxide, and silicon nitride.
17 . The endovascular prosthesis of claim 12 , where the encapsulating layer is formed as a composite material consisting of any combination of titanium oxide, aluminum oxide, tantalum oxide, and silicon nitride.
18 . A sensor element configured to operate in a monitoring device while integrated in a structure of an endovascular prosthesis, the sensor element comprising: a first metallic part; a second metallic part; and a sensor material formed between the first metallic part and the second metallic part, where the first and second metallic parts are conductors in a monitoring device detecting the electrical parameter shift in the sensor material, and where the first and second metallic parts and the sensor material are integrated with a wall structure of the endovascular prosthesis.Join the waitlist — get patent alerts
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