High speed, high density, low power die interconnect system

Abstract

A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias.

What is claimed is: 
     
         1 . A system comprising:
 a first die including a downwardly-facing surface;   a first inductive coupling portion arranged along the downwardly-facing surface of the first die;   a second die including an upwardly-facing surface; and   a second inductive coupling portion arranged along the upwardly-facing surface of the second die;   wherein the first inductive coupling portion and the second inductive coupling portion are configured to inductively couple the first die with the second die.