Multi-Port Polishing Fixture Assembly and Method of Surface Conditioning a Pick and Place Bond Head

Abstract

Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.

What is claimed is: 
     
         1 . A multi-port polishing fixture assembly comprising:
 a fixture base including a perimeter surface;   a plurality of kinematic clamps fastenable along the perimeter surface; and   a plurality of split holders fastenable to the perimeter surface with the plurality of kinematic plurality of kinematic clamps.   
     
     
         2 . The multi-port polishing fixture assembly of  claim 1 , wherein each split holder comprises a tubular member, and a slit in the tubular member extending from a distal end of the tubular member. 
     
     
         3 . The multi-port polishing fixture assembly of  claim 2 , wherein the slit partially extends down a longitudinal length of the tubular member. 
     
     
         4 . The multi-port polishing fixture assembly of  claim 1 , wherein each split holder comprises a pair of half-tubular bodies. 
     
     
         5 . The multi-port polishing fixture assembly of  claim 1 , wherein the plurality of split holders are secured to the corresponding plurality of kinematic clamps. 
     
     
         6 . The multi-port polishing fixture assembly of  claim 1 , wherein the plurality of split holders are physically separate from the corresponding plurality of kinematic clamps. 
     
     
         7 . The multi-port polishing fixture assembly of  claim 1 , wherein the perimeter surface includes a plurality of kinematic fixturing patterns to receive the plurality of split holders. 
     
     
         8 . The multi-port polishing fixture of  claim 7 , wherein each kinematic fixturing pattern is a V-groove. 
     
     
         9 . The multi-port polishing fixture assembly of  claim 1 , wherein each kinematic clamp includes a pressure bar and screw threaded through the pressure bar. 
     
     
         10 . The multi-port polishing fixture assembly of  claim 9 , wherein the fixture base includes a plurality of threaded holes along the perimeter surface, each hole to receive the screw of a corresponding kinematic clamp. 
     
     
         11 . A method of conditioning a pick and place bond head comprising:
 loading a multi-port polishing fixture assembly with a plurality of tools secured within a corresponding plurality of split holders; and   polishing the plurality of tools and corresponding plurality of split holders.   
     
     
         12 . The method of  claim 11 , further comprising:
 loading the multi-port polishing fixture assembly with a plurality of dummy rods;   pressing the plurality of dummy rods against a polishing pad;   setting a polishing height for the plurality of tools and corresponding plurality of split holders; and   fastening the plurality of tools and corresponding plurality of split holders at the polishing height.   
     
     
         13 . The method of  claim 11 , wherein loading the multi-port polishing fixture assembly with the plurality of tools secured within a corresponding plurality of split holders comprises fastening the plurality of split holders to a perimeter surface of a fixture base with a plurality of kinematic clamps. 
     
     
         14 . A pick and place bond head comprising:
 an elongate body;   a pedestal at a distal end of the elongate body; and   a plurality of mesa structures extending from the pedestal, each mesa structure including a distal bond surface including one or more vacuum holes.   
     
     
         15 . The pick and place bond head of  claim 14 , wherein the one or more vacuum holes extend through an axial length of the elongate body. 
     
     
         16 . The pick and place bond head of  claim 14 , wherein the one or more vacuum holes is a plurality of vacuum holes fluidly connected to a shared vacuum channel in the pick and place bond head. 
     
     
         17 . The pick and place bond head of  claim 14 , wherein the distal bond surface is characterized by an average surface roughness (Ra) of 50 nm-0.5 μm. 
     
     
         18 . The pick and place bond head of  claim 14 , wherein the distal bond surface is characterized by a flatness of less than 300 nm. 
     
     
         19 . The pick and place bond head of  claim 14 , wherein a total surface area including each distal bond surface of the pick and place bond head is characterized by a flatness of less than 300 nm. 
     
     
         20 . The pick and place bond head of  claim 14 , wherein the distal bond surface has a maximum lateral dimension of less than 500 μm. 
     
     
         21 . The pick and place bond head of  claim 20 , wherein each vacuum hole has a maximum width of less than 75 μm.