Electronic component ceiling mounting systems and methods

Abstract

Techniques described herein relate to integrating an electronic component into a ceiling mount in a ceiling tile system so as to maintain the aesthetic integrity of the ceiling while providing a suitable structural system to secure the equipment into the ceiling. The techniques further include one or more apparatuses having a cutting element for efficiently cutting the specified tile to accommodate the electronic component ceiling mount.

What is claimed: 
     
         1 . An electronic component mounting apparatus, comprising:
 a can configured to receive and secure an electronic component, the can comprising a first end and a second end;   a housing releasably connectable to the first end of the can and configured to cover the first end of the can and communicate with a ceiling tile; and   a cutting edge disposed on the second end of the can, the cutting edge being configured to cut through a ceiling tile to form an opening in the ceiling tile that approximates a shape of the can.   
     
     
         2 . The electronic component mounting apparatus as recited in  claim 1 , wherein the cutting edge is integrated into the second end of the can. 
     
     
         3 . The electronic component mounting apparatus as recited in  claim 1 , wherein the cutting edge is releasably connectable to the second end of the can. 
     
     
         4 . The electronic component mounting apparatus as recited in  claim 3 , further comprising a securing mechanism to hold the cutting edge in a fixed position relative to the can. 
     
     
         5 . The electronic component mounting apparatus as recited in  claim 1 , wherein the cutting edge is sufficiently capable to cut through an acoustic tile. 
     
     
         6 . The electronic component mounting apparatus as recited in  claim 1 , further comprising a securing mechanism to secure the electronic component mounting apparatus to the ceiling tile. 
     
     
         7 . A method for installing an electronic component mounting apparatus, comprising forming a hole in a ceiling tile with a cutting edge integrated with an electronic component mount. 
     
     
         8 . The method as recited in  claim 7 , further comprising:
 inserting an electronic component mount thorough the hole in the ceiling tile so that a housing of the electronic component is substantially flush with a side of the ceiling tile; and   securing the electronic component mount to the ceiling tile.   
     
     
         9 . The method as recited in  claim 8 , further comprising securing a protective cover over the cutting edge of the electric component mount. 
     
     
         10 . The method as recited in  claim 7 , wherein forming the hole further comprises:
 aligning a template with the ceiling tile such that the template indicates where to form the hole in the ceiling tile; and   cutting the hole in the ceiling tile in a location indicated by the template.   
     
     
         11 . The method as recited in  claim 10 , wherein:
 the template further comprises a backer plate configured to approximate the size of the ceiling tile; and   the method further comprises securing the electronic component to the ceiling tile and the backer plate.   
     
     
         12 . The method as recited in  claim 7 , further comprising installing an electronic component into the electronic component mount. 
     
     
         13 . A method for installing an electronic component in a ceiling, comprising:
 using a template to mark a location to install a component mount in the ceiling;   cutting a hole in the ceiling at the marked location using a cutting edge that is integrated with a first end of the component mount;   inserting the component mount through the hole in the ceiling so that the first end of the component extends about the ceiling; and   securing the component mount to the ceiling.   
     
     
         14 . The method as recited in  claim 13 , further comprising attaching a housing to a second end of the component mount, the second end of the component mount being oppositely disposed from the first end of the component mount. 
     
     
         15 . The method as recited in  claim 13 , further comprising removing the cutting edge from the component mount. 
     
     
         16 . The method as recited in  claim 13 , further comprising retracting the cutting edge from the first end of the component mount. 
     
     
         17 . The method as recited in  claim 13 , wherein:
 the ceiling further comprises a ceiling tile that makes up a portion of a ceiling; and   the method further comprises fixing the template to the ceiling tile such that when the ceiling tile is installed, the template is disposed above the ceiling tile.   
     
     
         18 . The method as recited in  claim 13 , wherein the template further comprises a backing plate that provides significant support to the component mount. 
     
     
         19 . The method as recited in  claim 13 , further comprising mounting an electronic component inside the component mount. 
     
     
         20 . The method as recited in  claim 13 , further comprising securing a protective cover over the cutting edge of the component mount.