Fan comprising a cooling body consisting of heat-conductive plastic

Abstract

The invention relates to a fan (1) comprising an electronic system on a printed circuit board (2) and a cover (10) arranged above the electronic system, which is embodied both as an active cooling body and a passive cooling body, wherein the cover (10) is designed substantially as a flat covering element consisting of a thin-walled plastic and has a form with a surface (11) which is effective for the cooling of the electronic system arranged beneath the cover (10), said surface being larger than the projected base area of the cover (10) by a factor of at least 2.

1 . A fan ( 1 ), comprising an electronic system on a printed circuit board ( 2 ) and a cover ( 10 ) arranged above the electronic system, which is embodied both as an active cooling body and a passive cooling body, wherein the cover ( 10 ) is designed substantially as a flat covering element consisting of a thin-walled plastic and has a form with a surface ( 11 ) which is effective for the cooling of the electronic system arranged beneath the cover ( 10 ), said surface being larger than the projected base area of the cover ( 10 ) by a factor of at least 
     
     
         2 . The fan ( 1 ) according to  claim 1 , characterized in that the cover ( 10 ) has a cooling fin structure with a plurality of cooling fins ( 12 ). 
     
     
         3 . The fan ( 1 ) according to  claim 1 , characterized in that the cover ( 10 ) forms a plurality of recesses ( 13 ) in which fastening holes ( 14 ) are provided at which the cover ( 20 ) is detachably fastened to the fan ( 1 ) by releasable fastening means ( 15 ). 
     
     
         4 . The fan ( 1 ) according to  claim 2 , characterized in that the cover ( 10 ), in the area of the cooling fin structure, has a flat contact side ( 16 ) for contacting heat-producing components. 
     
     
         5 . The fan ( 1 ) according to  claim 2 , characterized in that the cover ( 10 ) has the cooling fin structure in one or more areas. 
     
     
         6 . The fan ( 1 ) according to  claim 2 , characterized in that the cooling fins ( 12 ) are attached or formed to extend radially outwards. 
     
     
         7 . The fan ( 1 ) according to  claim 2 , characterized in that the cooling fins ( 12 ) have a changing, in particular outwardly decreasing, wall thickness. 
     
     
         8 . The fan ( 1 ) according to  claim 1 , characterized in that the cover ( 10 ) forms a flat contact surface ( 19 ) on the bottom facing the electronic system, and in that, in the assembled state, this contact surface at least partially abuts electronic components. 
     
     
         9 . The fan ( 1 ) according to  claim 1 , characterized in that the cover ( 10 ) is formed from a substantially round section ( 17 ) integrally joined to a projection ( 18 ). 
     
     
         10 . The fan ( 1 ) according to  claim 1 , characterized in that the material of the cover ( 10 ) is a polyamide (PA), polyurethane (PUR), polycarbonate (PC) or polyethylene (PE). 
     
     
         11 . The fan ( 1 ) according to  claim 8 , characterized in that the thickness of the cover ( 10 ) is smaller in the area parallel to the arrangement of the printed circuit board ( 2 ) and/or the area of the flat contact surface ( 19 ) than in a periphery ( 20 ) or in the area of the cover ( 10 ) extending towards the electronic system by a factor of at least 2. 
     
     
         12 . The fan ( 1 ) according to  claim 1 , characterized in that the fan is a radial fan.