US2021259573A1PendingUtilityA1

Tissue detection devices, systems and methods

Assignee: BLOSSOM INNOVATIONSPriority: Mar 13, 2019Filed: Mar 5, 2021Published: Aug 26, 2021
Est. expiryMar 13, 2039(~12.6 yrs left)· nominal 20-yr term from priority
A61B 18/14A61B 5/0537A61B 2560/0214A61B 5/746A61B 5/742A61B 5/063A61B 5/0536A61B 5/7405A61B 2018/00898A61B 2018/00083A61B 5/0015A61B 10/0283A61B 2018/00577A61B 5/0538A61B 2018/00077A61B 18/1477A61B 2010/045A61B 2018/00875A61B 2018/00755A61B 2018/1427
54
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Claims

Abstract

An exemplary tissue detection and location identification apparatus can include, for example, a first electrically conductive layer at least partially (e.g., circumferentially) surrounding a lumen, an insulating layer at least partially (e.g., circumferentially) surrounding the first electrically conductive layer, and a second electrically conductive layer circumferentially surrounding the insulating layer, where the insulating layer can electrically isolate the first electrically conductive layer from the second electrically conductive layer. A further insulating layer can be included which can at least partially surrounding the second electrically conductive layer. The first electrically conductive layer, the insulating layer, and the second electrically conductive layer can form a structure which has a first side and a second side disposed opposite to the first side with respect to the lumen, where the first side can be longer than the second side thereby forming a sharp pointed end via the first side at a distal-most portion. The exemplary configuration can be used for (a) determination/detection of a tissue type using impendence of the electrically conductive layers, and/or (ii) determination of a location of at least one portion of the insertion device/apparatus.

Claims

exact text as granted — not AI-modified
1 - 29 . (canceled) 
     
     
         30 . A method for making an insertion arrangement, comprising:
 a) providing an insulating layer on a tubular hollow structure to form a first structure;   b) providing a conductive layer to the first structure to form a second structure;   c) cutting the second structure to a predetermined length to form a third structure; and   d) producing a predetermined shape at a distal end of the third structure by at least one of cutting or grinding at least one end of the third structure so as to form the insertion arrangement which includes a conductive portion at or near at least one end thereof that is at least partially separated from the tubular hollow structure via at least one portion of the insulating layer,   wherein the conductive portion is formed based on the conductive layer, and the insulating portion is formed based on the insulating layer.   
     
     
         31 . The method of  claim 30 , further comprising heating the first structure after procedure (a) so as to at least one of (i) remove any solvent from the first structure, or (ii) polymerize the insulating layer. 
     
     
         32 . The method of  claim 30 , further comprising heating the second structure after procedure (b) so as to at least one of (i) remove any solvent from the second structure, or (ii) polymerize the conductive layer. 
     
     
         33 . The method of  claim 30 , wherein the first structure is formed by spraying the conductive layer on the tubular hollow structure. 
     
     
         34 . The method of  claim 30 , wherein the second structure is formed by spraying the conductive layer on the first structure. 
     
     
         35 . The method of  claim 30 , wherein the insulating layer includes an insulating polyimide coating. 
     
     
         36 . The method of  claim 30 , wherein the conductive layer includes a silver conductive coating. 
     
     
         37 . The method of  claim 30 , wherein procedures (a)-(c) are performed without masking and etching any of the first structure or the second structure. 
     
     
         38 . The method of  claim 30 , wherein the hollow tubular structure includes a stainless steel body. 
     
     
         39 . The method of  claim 30 , wherein the insertion arrangement includes a needle. 
     
     
         40 . The method of  claim 30 , wherein the insertion arrangement includes a cannula. 
     
     
         41 . The method of  claim 30 , wherein the distal end includes a tip of the insertion arrangement. 
     
     
         42 . The method of  claim 41 , wherein the tip has a pointed shape. 
     
     
         43 . The method of  claim 30 , wherein the producing of the predetermined shape at the distal end of the third structure is performed by grinding the at least one end of the third structure. 
     
     
         44 . The method of  claim 30 , wherein the insulating layer includes an insulating coating. 
     
     
         45 . The method of  claim 30 , wherein the conductive layer includes a conductive coating. 
     
     
         46 . The method of  claim 30 , wherein at least one of procedures (a) or (b) are performed using at least one of electrochemical deposition, vapor deposition or sputtering. 
     
     
         47 . A method for making an insertion arrangement, comprising:
 a) providing an insulating structure on a tubular hollow structure to form a first structure;   b) providing a conductive structure to the first structure to form a second structure;   c) cutting the second structure to a predetermined length to form a third structure; and   d) producing a predetermined shape at a distal end of the third structure by at least one of cutting or grinding at least one end of the third structure so as to form the insertion arrangement which includes a conductive portion at or near at least one end thereof that is at least partially separated from the tubular hollow structure via an insulating portion which is at least partially made of the insulating structure,   wherein the conductive portion is at least partially made of the conductive structure.   
     
     
         48 . The method of  claim 47 , wherein the insulating structure includes an insulating coating. 
     
     
         49 . The method of  claim 47 , wherein the conductive structure includes a conductive coating. 
     
     
         50 . The method of  claim 47 , wherein at least one of procedures (a) or (b) are performed using at least one of electrochemical deposition, vapor deposition or sputtering.

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